Texas Instruments (TI) has unveiled six power modules using its MagPack integrated magnetic packaging technology designed to improve power density, enhance efficiency and reduce electromagnetic interference.
MagPack technology enables a shrinking of the size by as much as 23% compared to other modules for industrial, enterprise and communication applications.
TI claims that three of the new devices — TPSM82866A, TPSM82866C and TPSM82816 — are the smallest 6 amp power modules with a power density of nearly 1 amp per 1 sq mm of area.
The MagPack 3D package molding process includes an integrated power inductor with proprietary engineered material. This allows for the devices to reduce temperature and radiated emissions while achieving a high-power density and minimizing board space as well as system power losses.
These factors are important in data centers where electricity is a big cost factor.
“Designers turn to power modules to save on time, complexity, size and component count, but these benefits have required a compromise on performance — until now,” said Jeff Morroni, director of power management research and development at TI’s Kilby Labs. “After nearly a decade in the making, TI’s integrated magnetic packaging technology enables power designers to meet the defining power trend that has shaped our industry – pushing more power in smaller spaces efficiently and cost-effectively.”
