AEM has launched a new burn-in capability for its AMPS high-parallel test platform.
Announced at this week’s SEMICON West 2024, the variant tool, called AMPS-BI, is a fully automated burn-in system that includes multi-zone intelligent thermal control. The tool is designed to perform high voltage stress testing on advanced semiconductor devices like AI processors and computing units.
These types of stress tests are important because they expose these chips to extend periods of operation under stressful conditions for the detection of potential failures or defects. This is critical to identify these problems before the devices reach the end consumer.
AI processors are becoming more in demand and more complex with the introduction of heterogeneous packages with chiplets.
AMPS-BI reduces the time it takes to detect these issues while increasing overall test coverage.
Other features of the tool include:
- Fully automated modular system
- Scalable to greater than 2 KW per device
- Application-specific test instruments
- Individual device test control and instrumentation
- Support for device-specific change kits and consumables
- Support for advanced package formats
- Upgradable for system level test, tri-temperature and higher throughput
- Supports JEDEC-based I/O
