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Supply Chain
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Littelfuse unveils high-performance Ultra Junction X4-Class 200 V power MOSFETs for enhanced efficiency and reliability
The design delivers industry-leading low on-state resistance, enabling simplified design and enhanced performance in battery energy storage and power supply applications.
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Vishay Intertechnology 40 V MOSFET in PowerPAK 10x12 package offers best in class RDS(ON) of 0.34 mO to increase efficiency
The MOSFET features a bond-wireless design that minimizes parasitic inductance while maximizing current capability.
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Lam launches first wafer fab maintenance cobot
The robot will minimize tool downtime and increase production variability.
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CHIPS Act roundup: 5 companies to receive funding
Two companies have finalized funding, while three have received preliminary investment agreements.
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SIA: Global chip sales to grow 19% in 2024
The double-digit growth will continue in 2025.
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GF nears GaN chip mass production
The pure play foundry received an additional $9.5 million from the U.S. government for the push toward semiconductor manufacturing.
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Advancing high-accuracy virtual design of power electronic applications
The Onsemi power loss model generator now includes passive components to more accurately model designs and enable customers to go to market faster.
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Metis-e radio module: Optimized for metering applications
The module can be used both as a transmitter for a meter as well as a receiver for a gateway or data collector.
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CES 2025: Two-way audio tech enhances gaming audio by 30%
xMEMS Labs and Merry Electronics will demonstrate a production-ready wireless over-the-ear headphone at the world’s largest trade show.
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GF signs foundry agreements with ICsense and Soitec
The deals will help boost ASIC manufacturing and RF-SOI substrates, respectively.
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Microchip to close Arizona fab amid inventory glut
The company will move its process technologies to its Oregon and Colorado factories.
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Creating a roadmap for space-powered 5G SATCOM
An ESA study finds deployment of such infrastructure could begin as early as 2025.
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Intel CEO Pat Gelsinger retires
The industry veteran leaves as the chip giant is struggling in a variety of sectors.
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SemiNex’ high power gain chip/RSOA Arrays win Gold Honoree in Laser Focus World Innovators Awards
The arrays with proprietary material system and advanced quantum-well waveguide design deliver excellent optical and thermal performances.
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Onsemi introduces the industry’s most advanced analog and mixed-signal platform
The Treo Platform features a modular architecture to accelerate development of intelligent power management, sensor interface and communications solutions.
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CHIPS Act roundup: More funding released; new packaging initiative
Rocket Lab and BAE latest being funded while $300 million in packaging funding is up for grabs.
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Vishay Intertechnology 150 V MOSFET increases efficiency with the industry’s lowest RDS(ON) of 5.6 mW and RDS(ON) Qg FOM of 336 mW nC
The device minimizes power losses from conduction, allowing designers to boost efficiency to meet next-generation power supply requirements.
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Safety-focused automotive gate driver board for brushless motors
The compact add-on board delivers precise and reliable control of brushless DC motors in automotive applications.
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High-speed test socket a winner at GEAA
Smiths Interconnect’s DaVinci 112 is designed for testing ASICs.
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‘Shift-left’ approach comes to Siemens’ Veloce system
The tool includes hardware/software development flow from virtual to hybrid to full RTL.
