Product Watch

One component, silver filled epoxy features extraordinary electrical and thermal conductivity.

ENCAPSULATED MAGNETS WRAPTITE CARBON FIBER ENCAPSULATION Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications. While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior design alternative...

ALPHA OM-220 is a new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy for soldering of temperature-sensitiv e components and substrates. This innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies.

SARCON^® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus therma...

Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulatin g.

Highly Conformable and Non-Flammable, Higher Thermal interface materials

Free flowing EP4EN-80 is suitable for bonding, small potting and encapsulations up to about a ¼ inch thick in some applications.

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion.