Product Watch

Materials

  • Low Temp Co-fired Multilayer Ceramic Substrates

    Supplier: NIKKO Company
    LTCC (Low Temperature Co-fired Multilayer Ceramic Substrates) Features Easy to achieve high number of layers Fine Line, small diameter via capabilities Various layer thicknesses available Capable of offering a Cavity structure Capable of creating surface resistors with trimming options Low resistance conductor...
  • LiPOLY-20.0 W/m*K Thermal Conductive Gap Filler

    Supplier: Shiu Li Technology Co., Ltd
    Shiu Li Technology-LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 is a high thermal conductivity material with insulating properties, offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
  • Flexible LED Curable Adhesive with Fluorescent Dye

    Supplier: Master Bond, Inc.
    Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity.
  • Ultra-High Performance Thermal Liquid Gap Filler

    Supplier: Shiu Li Technology Co., Ltd
    LiPOLY PK700DM is a two-part, low viscosity with good thixotropic characteristics thermal conductivity gap filler. With a thermal conductivity of 7.0 W/m*K. PK700DM provides high thermal conductivity and low thermal impedance; ultra-conforming, a gel-like material after being cured for fragile and low-stress applications. Available in 50ml and 400ml cartridges.
  • Don’t Sacrifice Performance for Cost Savings!

    Supplier: Shiu Li Technology Co., Ltd
    LiPOLY T-work series offers outstanding thermal conductivity at 11.0, 15.0, & 20.0 W/m*K with high insulating properties, and extremely low thermal resistance under minimal force. Our T-work series offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
  • Liquid Gap Filler- TWO-PART Fast Cured Material

    Supplier: Shiu Li Technology Co., Ltd
    Liquid Gap Filler- Ultra-Conforming Two-Part Fast Curing Thermal Conductive Gel
  • Sheldahl Flexible Technologies

    Supplier: Sheldahl Flexible Technologies - a Flex company
    From Flexible Circuits to Unidirectional tapes, Printed Electronics to our Thermal Control Materials, our capabilities enable us to create flexible solutions that span from the Automotive industry to outer space and everywhere in between.
  • Flexible Printed Circuits for Smart Packaging

    Supplier: Sheldahl Flexible Technologies - a Flex company
    Our Printed Electronics (PE) toolbox is as deep as it is wide, offering an extensive array of possibilities by combining film types, thicknesses, double-sided printing, ink types, and finishing options to produce your desired functionality. From simple switches to complex, functional, multi-layer prints with printed components, we have the capability to meet your needs.
  • Improving Thermal Management Film Adhesives

    Supplier: Henkel Adhesive Technologies - Aviation, Space and Rail
    Commercial and defense radar systems have become much more advanced over the past decade, resulting in smaller and more highly functionalized components. This increase in functionality and power generates more heat than ever and must be managed for proper operation of the radar system.
  • What's Next-Gen in Potting & Encapsulating?

    Supplier: ELANTAS PDG, Inc.
    Learn how ELANTAS low modulus materials can help improve reliability of embedded components by reducing internal and external stress generated on components. ELANTAS has also developed and patented its innovative Conashield™ "flood coat" technology which can provide ruggedization, weight reduction, and reliability improvements compared to traditional potting.
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