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Materials
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A new line of two-component thermal gap fillers
Supplier: Fujipoly® America Corp.Fujipoly® introduces a new line of two-component thermal gap fillers that also exhibit excellent electrical insulative properties. The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily... -
Boost Transistor Cooling Now with Tube Covers
Supplier: Fujipoly® America Corp.Fujipoly® tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon® tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating componen... -
Tube-Shaped TIMs are a Perfect Fit for Transistors
Supplier: Fujipoly® America Corp.Fujipoly® tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon® tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating componen... -
High-performance Thermal Putty
Supplier: Fujipoly® America Corp.New 4.5-Watt Thermal Putty Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K. Sarcon® PG45A requires very low compression force at high compression rates... -
High-performance, thermal gap filler pad
Supplier: Fujipoly® America Corp.New 13-Watt Thermal Gap Filler Fujipoly® recently released Sarcon® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 13 W/m°K. Sarcon® GR130A is available in five thicknesses (0.3, 0.5, 1.0, 1.5, and 2.0mm... -
Comprehensive engineering kit wtih free samples
Supplier: Fujipoly® America Corp.New Sarcon® Sample Kit Fujipoly® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon® materials in order to find the perfect option for their application. The wide selection of product... -
B-Staged Epoxy Featuring Flame Retardancy
Supplier: Master Bond, Inc.Master Bond EP36FR is a one component, B-staged epoxy for potting, encapsulation, coating and bonding. It meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. -
Enabling 5G From Start to Finish
Supplier: MacDermid Alpha Electronics SolutionsMacDermid Alpha has high reliability material solutions for electronic assemblies used in a broad range of 5G related equipment; from wearable and handheld mobile devices to antennas and high speed infrastructure hardware. Download new brochure. -
Two component silicone for thermal management
Supplier: Master Bond, Inc.Master Bond MasterSil 151TC is a two component silicone for use primarily in thermal management applications, for bonding or smaller gap filling. -
4-Watt Thin Film for High Power Applications
Supplier: Fujipoly® America Corp.Sarcon® 30YR-c from Fujipoly® is a compliant silicone thin film that is ideal for filling near-microscopic air gaps that exist between high-power heat generating components and heatsinks. By increasing surface area contact, it is possible to measurably improve cooling effectiveness and operational performance. Sarcon® 30YR-c is a high-performance 0.3mm thick material t...
