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Materials
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Enabling 5G From Start to Finish
Supplier: MacDermid Alpha Electronics SolutionsMacDermid Alpha has high reliability material solutions for electronic assemblies used in a broad range of 5G related equipment; from wearable and handheld mobile devices to antennas and high speed infrastructure hardware. Download new brochure. -
Two component silicone for thermal management
Supplier: Master Bond, Inc.Master Bond MasterSil 151TC is a two component silicone for use primarily in thermal management applications, for bonding or smaller gap filling. -
4-Watt Thin Film for High Power Applications
Supplier: Fujipoly® America Corp.Sarcon® 30YR-c from Fujipoly® is a compliant silicone thin film that is ideal for filling near-microscopic air gaps that exist between high-power heat generating components and heatsinks. By increasing surface area contact, it is possible to measurably improve cooling effectiveness and operational performance. Sarcon® 30YR-c is a high-performance 0.3mm thick material t... -
Sarcon® TIM Cases for Cooler Transistors
Supplier: Fujipoly® America Corp.In an effort to streamline your manufacturing process and improve transistor cooling, Fujipoly® offers a large assortment of box-shaped Sarcon® thermal interface caps. These cases are available in standard sizes to fit many transistors and can be custom ordered to your exact specifications. Installation takes seconds by sliding over the heat-generating component. Once fitted, unw... -
Versatile Sarcon® Thin Film
Supplier: Fujipoly® America Corp.Fujipoly® offers a large selection of thin film, thermal interface materials. Available in eight formulations, these Sarcon® materials offer versatility in managing heat dissipation while exhibiting useful characteristics such as electrical insulation, and UL94 VO flammability. The Sarcon® series of thin films range in thickness from 0.15mm to 0.85mm. Depending on the... -
High temperature resistant die attach epoxy
Supplier: Master Bond, Inc.Master Bond EP17HTS-DA is a one part, electrically conductive die attach epoxy that offers high temperature resistance. -
Four-Layer Rigid Flex Circuit
Supplier: Flexible Circuit Technologies, Inc.A four-layer combination rigid flex circuit has four conductive copper layers. Typically, a four-layer has two flexible layers and two rigid layers. -
Copper Surface Preparation Solutions
Supplier: MacDermid Alpha Electronics SolutionsOur Surface Preparation Solutions for both innerlayer and outerlayer cleaning address the challenges confronted by PCB fabricators, including the complex processing of increased layer counts, as well as the demands posed by harsh mechanical cleaning methods. -
Toughened Potting Compound
Supplier: Master Bond, Inc.NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications. -
Thermally Conductive, Flame Retardant Encapsulant
Supplier: Master Bond, Inc.Master Bond EP93AOFR is a two part, flame retardant epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. It fully complies with FAR standard 14 CFR 25.853(a) for flame retardancy.
