Product Watch

Materials

  • ALPHA® AccuFlux™ BTC-578 Solder Preforms

    Supplier: MacDermid Alpha Electronics Solutions
    Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC).
  • Fujipoly® Compression Testing Video

    Supplier: Fujipoly® America Corp.
    Fujipoly® recently published a video that demonstrates and explains compression testing for thermal interface materials.
  • Sinter Silver for Die and Package Attachment

    Supplier: MacDermid Alpha Electronics Solutions
    Alpha is extremely well positioned for the growing trend towards increased electrification of the automotive powertrain, enabling the highest efficiency power electronics, while achieving a reduced form factor, lower cost and an unprecedented increase in reliability.
  • Reinforced Thermal Film for Die-Cutting

    Supplier: Fujipoly® America Corp.
    Sarcon® 15GTR from Fujipoly® is a thin, thermal interface composite film made from heat-conducting silicone and a .05mm fiberglass reinforcement layer. The general-purpose, .15mm thick film is ideal for applications with complex die-cut shapes.
  • EP30LTE-2

    Supplier: Master Bond, Inc.
    Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required.
  • EP39MAOHT: Thermally Conductive Epoxy

    Supplier: Master Bond, Inc.
    Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system
  • ALPHA® tensoRED®

    Supplier: MacDermid Alpha Electronics Solutions
    ALPHA® tensoRED® Master Tensioning Frame is the latest development in Alpha’s stencil range of state-of-the-art printing stencils. ALPHA® tensoRED® has been designed to reduce the total cost of ownership of stencils compared to other systems by creating tension without the need of air pressure being applied to t...
  • Low Viscosity, Optically Clear Epoxy Compound

    Supplier: Master Bond, Inc.
    Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F.
  • Epoxy for Underfill Applications

    Supplier: Master Bond, Inc.
    Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W.
  • EP29LPAO

    Supplier: Master Bond, Inc.
    Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications
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