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Materials
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Sarcon® TIM Cases for Cooler Transistors
Supplier: Fujipoly® America Corp.In an effort to streamline your manufacturing process and improve transistor cooling, Fujipoly® offers a large assortment of box-shaped Sarcon® thermal interface caps. These cases are available in standard sizes to fit many transistors and can be custom ordered to your exact specifications. Installation takes seconds by sliding over the heat-generating component. Once fitted, unw... -
Versatile Sarcon® Thin Film
Supplier: Fujipoly® America Corp.Fujipoly® offers a large selection of thin film, thermal interface materials. Available in eight formulations, these Sarcon® materials offer versatility in managing heat dissipation while exhibiting useful characteristics such as electrical insulation, and UL94 VO flammability. The Sarcon® series of thin films range in thickness from 0.15mm to 0.85mm. Depending on the... -
High temperature resistant die attach epoxy
Supplier: Master Bond, Inc.Master Bond EP17HTS-DA is a one part, electrically conductive die attach epoxy that offers high temperature resistance. -
Four-Layer Rigid Flex Circuit
Supplier: Flexible Circuit Technologies, Inc.A four-layer combination rigid flex circuit has four conductive copper layers. Typically, a four-layer has two flexible layers and two rigid layers. -
Copper Surface Preparation Solutions
Supplier: MacDermid Alpha Electronics SolutionsOur Surface Preparation Solutions for both innerlayer and outerlayer cleaning address the challenges confronted by PCB fabricators, including the complex processing of increased layer counts, as well as the demands posed by harsh mechanical cleaning methods. -
Toughened Potting Compound
Supplier: Master Bond, Inc.NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications. -
Thermally Conductive, Flame Retardant Encapsulant
Supplier: Master Bond, Inc.Master Bond EP93AOFR is a two part, flame retardant epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. It fully complies with FAR standard 14 CFR 25.853(a) for flame retardancy. -
ALPHA® AccuFlux™ BTC-578 Solder Preforms
Supplier: MacDermid Alpha Electronics SolutionsAlpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC). -
Fujipoly® Compression Testing Video
Supplier: Fujipoly® America Corp.Fujipoly® recently published a video that demonstrates and explains compression testing for thermal interface materials. -
Sinter Silver for Die and Package Attachment
Supplier: MacDermid Alpha Electronics SolutionsAlpha is extremely well positioned for the growing trend towards increased electrification of the automotive powertrain, enabling the highest efficiency power electronics, while achieving a reduced form factor, lower cost and an unprecedented increase in reliability.
