Product Watch

Sarcon^® GR14B from Fujipoly^® is a low oil bleed/low specific gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is perfect for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thi...

Master Bond EP5G-80 is a one component, graphite filled epoxy paste for bonding, sealing and coating applications. It is electrically and thermally conductive.

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity.

One component, silver filled epoxy features extraordinary electrical and thermal conductivity.

ENCAPSULATED MAGNETS WRAPTITE CARBON FIBER ENCAPSULATION Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications. While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior design alternative...

ALPHA OM-220 is a new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy for soldering of temperature-sensitiv e components and substrates. This innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies.

SARCON^® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus therma...

Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulatin g.