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Materials
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New Silicone Gap Filler for Unique Applications
Supplier: Fujipoly® America Corp.Fujipoly America introduces SARCON® GR25B. This advanced silicone, gel-like thermal interface material delivers a thermal conductivity of 2.5 W/m•K and is a popular choice for higher power electronics applications. GR25B is offered in double sticky surfaces, hardened surfaces for easier handling, with polyester mesh to prevent stretching or with both hardened surface and mesh fo... -
Non-Flammable 13-Watt Thermal Gap Filler
Supplier: Fujipoly® America Corp.Highly Conformable and Non-Flammable 13-Watt Thermal Gap Filler SARCON® PG130A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extr... -
Newest Silicone Gap Filler Transfers Heat
Supplier: Fujipoly® America Corp.Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of SARCON® EGR30A makes it easy to handle and apply without requiring additional adhesive. When placed on top of a he... -
Silicone Foam for EV Batteries
Supplier: CHT USA Inc.CHT's liquid silicone foam is designed to reduce weight – as well as mitigate thermal runaway and provide protection from moisture, debris, vibration and shock for electronic components and EV battery packs. -
chemistry and coating expert for OEM designers
Supplier: PolyonicsPerformance Label and Tag Materials. Polyonics is the specialty chemistry and coating expert for label, tag and tape converters, specialty die cutters, OEM designers and specification engineers. -
Thermally Conductive Epoxy
Supplier: Master Bond, Inc.Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. -
ALPHA® OM-565 HRL3 Low Temperature Solder Paste
Supplier: MacDermid Alpha Electronics SolutionsALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions. -
UL Certified Epoxy Encapsulant Resists Arcing
Supplier: Master Bond, Inc.Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. -
Superior Thermal Transfer-Form-In-Place Gap Filler
Supplier: Fujipoly® America Corp.Superior Thermal Transfer from New Form-In-Place Gap Filler Fujipoly® America announces the release of its new SARCON® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating comp... -
Cost-Sensitive Thermal Interface Material
Supplier: Fujipoly® America Corp.Sarcon® GR14B from Fujipoly® is a low oil bleed/low specific gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is perfect for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thi...
