Product Watch

MacDermid Alpha Electronics Solutions announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates.

Fujipoly America introduces SARCON® GR25B. This advanced silicone, gel-like thermal interface material delivers a thermal conductivity of 2.5 W/m•K and is a popular choice for higher power electronics applications. GR25B is offered in double sticky surfaces, hardened surfaces for easier handling, with polyester mesh to prevent stretching or with both hardened surface and mesh fo...

Highly Conformable and Non-Flammable 13-Watt Thermal Gap Filler SARCON^® PG130A from Fujipoly^® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extr...

Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves Fujipoly^® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of SARCON^® EGR30A makes it easy to handle and apply without requiring additional adhesive. When placed on top of a he...

CHT's liquid silicone foam is designed to reduce weight – as well as mitigate thermal runaway and provide protection from moisture, debris, vibration and shock for electronic components and EV battery packs.

Performance Label and Tag Materials. Polyonics is the specialty chemistry and coating expert for label, tag and tape converters, specialty die cutters, OEM designers and specification engineers.

Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting.

ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions.