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Materials
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Reinforced Thermal Film for Die-Cutting
Supplier: Fujipoly® America Corp.Sarcon® 15GTR from Fujipoly® is a thin, thermal interface composite film made from heat-conducting silicone and a .05mm fiberglass reinforcement layer. The general-purpose, .15mm thick film is ideal for applications with complex die-cut shapes. -
EP30LTE-2
Supplier: Master Bond, Inc.Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. -
EP39MAOHT: Thermally Conductive Epoxy
Supplier: Master Bond, Inc.Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system -
ALPHA® tensoRED®
Supplier: MacDermid Alpha Electronics SolutionsALPHA® tensoRED® Master Tensioning Frame is the latest development in Alpha’s stencil range of state-of-the-art printing stencils. ALPHA® tensoRED® has been designed to reduce the total cost of ownership of stencils compared to other systems by creating tension without the need of air pressure being applied to t... -
Low Viscosity, Optically Clear Epoxy Compound
Supplier: Master Bond, Inc.Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F. -
Epoxy for Underfill Applications
Supplier: Master Bond, Inc.Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. -
EP29LPAO
Supplier: Master Bond, Inc.Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications -
EP3HTS-LO
Supplier: Master Bond, Inc.Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. -
Supreme 3HTND-2CCM
Supplier: Master Bond, Inc.Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, one part epoxy system that can be used for bonding, sealing, coating, potting and glob topping. -
Tape and Reel Solder Preforms
Supplier: MacDermid Alpha Electronics SolutionsALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y...
