Product Watch

The SARCON^® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON^® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to...

Fundamentals of Heat Transfer in Thermal Interface Gap Filler Materials

Supreme 3DM-85 is a thixotropic paste material formulated to serve as the damming compound in dam-and-fill encapsulation applications.

Introduction - Compression characteristics are a key function of gap fillers. Unlike thermal greases, the applications for gap fillers are quite different. Being mindful of compression characteristics and the factors that impact stress is important during the design phase to avoid over-stressing the printed circuit board (PCB). What are Gap Fillers? Gap fillers are a...

Ellsworth Adhesives is excited to announce our partnership with Aculon® for their NanoProof® series of products.

SARCON^® PG65A from Fujipoly^® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely low material compression. This low modulus thermal gap filler also...

Silicone gels are used in numerous electronic applications when a soft and highly flexible encapsulation or potting is required. CHT’s silicone gels protect delicate components and assemblies from vibration, thermal and mechanical shock, as well as guard against moisture corrosion and other harsh environmental factors.

Electronics function in many different applications. However, there is a common requirement to protect sensitive components and systems from moisture and harsh environmental elements.