Product Watch

Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required.

Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of Sarcon® EGR-11F makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient tr...

Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system

ALPHA^® tensoRED^® Master Tensioning Frame is the latest development in Alpha’s stencil range of state-of-the-art printing stencils. ALPHA^® tensoRED^® has been designed to reduce the total cost of ownership of stencils compared to other systems by creating tension without the need of air pressure being applied to t...

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F.

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10^-6 K•m²/W.

Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries.