Product Watch

Materials

  • Thermally Conductive Potting Compound

    Supplier: Master Bond, Inc.
    Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
  • New thermal interface material

    Supplier: Fujipoly® America Corp.
    Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of Sarcon® EGR-11F makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient tr...
  • EP39MAOHT: Thermally Conductive Epoxy

    Supplier: Master Bond, Inc.
    Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system
  • ALPHA® tensoRED®

    Supplier: MacDermid Alpha Electronics Solutions
    ALPHA® tensoRED® Master Tensioning Frame is the latest development in Alpha’s stencil range of state-of-the-art printing stencils. ALPHA® tensoRED® has been designed to reduce the total cost of ownership of stencils compared to other systems by creating tension without the need of air pressure being applied to t...
  • Low Viscosity, Optically Clear Epoxy Compound

    Supplier: Master Bond, Inc.
    Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F.
  • Epoxy for Underfill Applications

    Supplier: Master Bond, Inc.
    Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W.
  • EP29LPAO

    Supplier: Master Bond, Inc.
    Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications
  • EP3HTS-LO

    Supplier: Master Bond, Inc.
    Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries.
  • Supreme 3HTND-2CCM

    Supplier: Master Bond, Inc.
    Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, one part epoxy system that can be used for bonding, sealing, coating, potting and glob topping.
  • EP3SP5FL: One component “snap cure” epoxy adhesive

    Supplier: Master Bond, Inc.
    Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is readily reworkable.
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