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Materials
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Thermally Conductive Epoxy
Supplier: Master Bond, Inc.Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. -
ALPHA® OM-565 HRL3 Low Temperature Solder Paste
Supplier: MacDermid Alpha Electronics SolutionsALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions. -
UL Certified Epoxy Encapsulant Resists Arcing
Supplier: Master Bond, Inc.Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. -
Superior Thermal Transfer-Form-In-Place Gap Filler
Supplier: Fujipoly® America Corp.Superior Thermal Transfer from New Form-In-Place Gap Filler Fujipoly® America announces the release of its new SARCON® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating comp... -
Cost-Sensitive Thermal Interface Material
Supplier: Fujipoly® America Corp.Sarcon® GR14B from Fujipoly® is a low oil bleed/low specific gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is perfect for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thi... -
Graphite Filled Epoxy
Supplier: Master Bond, Inc.Master Bond EP5G-80 is a one component, graphite filled epoxy paste for bonding, sealing and coating applications. It is electrically and thermally conductive. -
NASA Low Outgassing Silver Filled Epoxy EP3HTS-TC
Supplier: Master Bond, Inc.One component, silver filled epoxy features extraordinary electrical and thermal conductivity. -
Wraptite composite sleeves offer superior design
Supplier: Arnold Magnetic TechnologiesENCAPSULATED MAGNETS WRAPTITE CARBON FIBER ENCAPSULATION Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications. While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior design alternative... -
ALPHA OM-220 Ultra-low Temperature Solder Paste
Supplier: MacDermid Alpha Electronics SolutionsALPHA OM-220 is a new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy for soldering of temperature-sensitiv e components and substrates. This innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. -
New! Extremely Low Compression Force Thermal Putty
Supplier: Fujipoly® America Corp.SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus therma...
