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Materials
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Charging Infrastructure: Heat-management solutions
Supplier: ELANTAS North America LLCThe charging infrastructure is key to the success of emobility. Customers expect short and effective charging times that power up the vehicle. With the charging times getting shorter the energy transported over the time gets higher. For this reason, management of heat flow and electrical insulation of the components become more demanding. -
Conformable & Non-Flammable Thermal Gap Filler
Supplier: Fujipoly® America Corp.Non-Flammable 13-Watt Thermal Gap Filler -
Challenges/Solutions for Pick & Place Automation
Supplier: Fujipoly® America Corp.ON DEMAND WEBINAR: Challenges and Solution for Pick and Place Automation of Thermal Gap Filler Pads Automation in electronics manufacturing is nothing new, but today many thermal gap filler pads are still placed by hand. With an increasing demand for automation the need to incorporate gap filler pad installation into automated processes is growing. In this webinar we will... -
Two-Part Gap Filler-perfect for large, uneven gaps
Supplier: Fujipoly® America Corp.The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to... -
Fundamentals of Heat Transfer in Thermal Interface
Supplier: Fujipoly® America Corp.Fundamentals of Heat Transfer in Thermal Interface Gap Filler Materials -
Toughened Epoxy for Dam-and-Fill Encapsulation
Supplier: Master Bond, Inc.Supreme 3DM-85 is a thixotropic paste material formulated to serve as the damming compound in dam-and-fill encapsulation applications. -
Compression Characteristics of Thermal Gap Fillers
Supplier: Fujipoly® America Corp.Introduction - Compression characteristics are a key function of gap fillers. Unlike thermal greases, the applications for gap fillers are quite different. Being mindful of compression characteristics and the factors that impact stress is important during the design phase to avoid over-stressing the printed circuit board (PCB). What are Gap Fillers? Gap fillers are a... -
Ellsworth Adhesives Partners with Aculon®
Supplier: Ellsworth AdhesivesEllsworth Adhesives is excited to announce our partnership with Aculon® for their NanoProof® series of products. -
Extremely compressible thermal interface materials
Supplier: Fujipoly® America Corp.SARCON® PG65A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely low material compression. This low modulus thermal gap filler also... -
Silicone Gels for use in Electronics
Supplier: CHT USA Inc.Silicone gels are used in numerous electronic applications when a soft and highly flexible encapsulation or potting is required. CHT’s silicone gels protect delicate components and assemblies from vibration, thermal and mechanical shock, as well as guard against moisture corrosion and other harsh environmental factors.
