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Materials
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Extremely Compressible Gap Filler, Conformable
Supplier: Fujipoly® America Corp.Highly Conformable and Non-Flammable, Higher Thermal interface materials -
The need for ruggedizing high reliability circuits
Supplier: ELANTAS North America Inc.ELANTAS PDG's conformal coatings are polymers that are applied in thin and thick layers to protect and electrically insulate printed circuit boards and electrical components from environmental stresses. The coatings can be sprayed, dip coated, hot melt applied, or brushed. Our conformal coatings can improve device performance and reduce the space needed between electrical traces. -
Fast Cure Epoxy for Bonding & Small Encapsulations
Supplier: Master Bond, Inc.Free flowing EP4EN-80 is suitable for bonding, small potting and encapsulations up to about a ¼ inch thick in some applications. -
ALPHA® HiTech Underfill Epoxy for Chip Packaging
Supplier: MacDermid Alpha Electronics SolutionsALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion. -
Low Residue Solder Paste for Fine-Pitch Components
Supplier: MacDermid Alpha Electronics SolutionsALPHA OM-372 is designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability, such as those found in mobile and wearables, computing, and medical assemblies. -
Thermal Interface Materials 101
Supplier: BoydConsumer demand is hot for more compact, more powerful electronics. But the denser circuits required for smaller devices generate more heat, making higher performing thermal management materials a necessity. In this webinar, Boyd Corporation and 3M™ will focus on thermal management materials that quickly and efficiently dissipate heat, even within tight spaces. -
A new line of two-component thermal gap fillers
Supplier: Fujipoly® America Corp.Fujipoly® introduces a new line of two-component thermal gap fillers that also exhibit excellent electrical insulative properties. The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily... -
Boost Transistor Cooling Now with Tube Covers
Supplier: Fujipoly® America Corp.Fujipoly® tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon® tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating componen... -
Tube-Shaped TIMs are a Perfect Fit for Transistors
Supplier: Fujipoly® America Corp.Fujipoly® tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon® tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating componen... -
High-performance Thermal Putty
Supplier: Fujipoly® America Corp.New 4.5-Watt Thermal Putty Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K. Sarcon® PG45A requires very low compression force at high compression rates...