Bosch Sensortec GmbH is partnering with assembly and test provider Advanced Semiconductor Engineering Inc. (ASE) to bring to market the smallest 3-axis microelectromechanical systems (MEMS) accelerometer on the market.
ASE specializes in wafer level packaging technologies for use in reducing the size of semiconductors when implemented into systems. For Bosch, this means creating an accelerometer with the smallest package they can get, maybe even the same size of the die itself. Bosch will target the sensor device for low-power consumer electronics applications such as the Internet of Things (IoT).
Wolfgang Lohner, CFO of Bosch, said in a statement as the company rolled out its latest sensor technology “it was clear we needed a solid and reliable partner that could effectively deliver both the technology and manufacturing capabilities require to bring our product to a dynamic market in a timely fashion.” Lohner added that “ASE successfully delivered on both fronts.”
As the semiconductor industry moves toward smaller and thinner form factors, new packaging techniques is becoming a innovate and differentiate in the market, Fuyu Shih, vice president of sales and marketing at ASE, in a statement. “Driven by mutual desire to innovate and create, while addressing new demands related to product integration, mobility, and reliability, ASE is pleased that our deep technology integration with Bosch Sensortec produced a milestone sensor device, hence positioning them well within the market.”