Pure-play foundries GlobalFoundries (GF) and Taiwan Semiconductor Manufacturing Co. (TSMC) have signed a manufacturing agreement to establish a U.S.-based supply of silicon interposers for TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.
Under the $2 billion deal, GF will provide fabrication services to TSMC and will add fabrication capacity at its Malta, New York, fab to support the manufacturing of silicon interposers. The agreement, which is for an initial term of five years, also includes potential expansion capacity for the interposers as demand grows, the companies said.
GF said the expansion of the Malta facility will help to establish the first U.S.-based source of silicon interposers with embedded deep trench capacitors to support TSMC’s CoWoS packaging technologies. Further expansions could support multiple generations of advanced packaging solutions, GF said.
“Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems,” said Ed Kaste, senior vice president of CMOS Business at GF. “By providing manufacturing service using GF’s trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain.”
Volume production of the silicon interposers is expected to begin ramping up in the first half of 2028.
