Industrial Electronics

Samtec releases 1.85 mm 30° angled launch connectors

01 September 2026

Samtec now offers full production quantity availability of its new 1.85 mm 30° angled launch board connector. The 185-AL series delivers precision radio frequency (RF) performance through 67 GHz while solving common mechanical and routing challenges found in dense, millimeter wave lab test and evaluation environments.

Modern RF and high-speed digital test boards often face tight mechanical constraints that make cable Source: SamtecSource: Samtec routing difficult or unreliable. The 30° angled launch geometry of the Samtec 185-AL series allows coaxial cables to exit the PCB in a natural direction, significantly reducing sharp bends that can degrade electrical stability.

The solderless, compression mount design enables field replaceable functionality. Eliminating the need for solder reflow enables rapid connect/disconnect to the printed circuit board, significantly reducing downtime and allowing connector reuse. It also removes performance variability that can occur with solder, enabling repeatable precision millimeter wave performance.

Threaded coupling provides high mechanical reliability. Mating interconnects include Samtec’s high-performance microwave cable assemblies, such as .047-inch diameter RF047-A series cable, .086-inch diameter RF086 series cable and stable during flexure Nitrowave LL071 series cable. Mechanical stress when bending or twisting can change the dielectric’s properties and alter performance, with effects more pronounced at higher frequencies. Nitrowave cable’s optimized cable construction, which includes a dynamic performance layer, protects from measurement errors that can occur due to flexure.

At millimeter wave frequencies, connector launches become increasingly complex. Samtec offers signal integrity support such as board launch optimization, e-field simulation and 3D modeling to help ensure maximum performance through a system.

The 1.85 mm 30° angled launch connectors are available from Samtec.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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