GlobalFoundries and Microchip are collaborating on the production of the third generation embedded SuperFlash technology non-volatile memory flash on GF’s 28 nm process.
The flash memory chips are designed for use in smart cards, microcontrollers and internet of things (IoT) devices.
According to the companies, the 28SLPe foundry process used to manufacture the non-volatile flash technology is beneficial due to:
- Only 10 masks added, including true 5V IO CMOS devices
- Temperature range of -40° C to 125° C.
- Sub-25 ns read access times
- 10-microsecond program times
- Four millisecond erase times
- Endurance exceeding 100,000 program/erase cycles
- No impact to design flows
- Off-the-shelf macros from 4 Mb to 32 Mb
- Access to custom macro design support
Use cases for embedded flash are exploding with the drive for increased intelligence at the edge. Embedded memory for secure code storage, over-the-air-updates and enhanced functionality is on the rise in a wide range of applications in home and industrial IoT as well as smart mobile devices. Innovative platforms are required to meet these needs.
Additionally, the flash is used in applications as embedded memory for secure code storage, over-the-air updates and to enhance functionality. These functions are needed for complex smart cards and IoT chips for consumer and industrial products.
