Taiwan Semiconductor Manufacturing Co. (TSMC) has worked with the Open Innovation Platform (OIP) 3DFabric Alliance to create the new 3Dblox 2.0 open standard.
The 3Dblox 2.0 features early 3D semiconductor design capability with the goal of boosting efficiency. Meanwhile the 3DFabric Alliance will work on memory, substrate, testing, manufacturing and packaging integration, TSMC said.
The overall goal of the 3Dblox open standards is to advance 3D IC design in the semiconductor industry and TSMC is working with an ecosystem of companies. The 3D architecture will power domain specification and 3D physical constructs in a holistic environment and simulate power and thermal for the whole 3D system, TSMC said.
The consortium will also support chiplet design reuse like chiplet mirroring to further design productivity.
3Dblox is supported by Electronic Design Automation (EDA) vendors to modularize and streamline 3D chip design within the semiconductor industry. These companies will provide analysis into design decisions such as accelerating design turnaround time from architecture to final implementation.
EDA vendors attached to the 3Dblox consortium include Ansys, Cadence, Siemens and Synopsys. Along with 10 technical groups with the purpose to maintain interoperability of EDA tools.
