Join Palomar Technologies at the 55th International Symposium on Microelectronics being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center in Boston from October 4 to October 6, 2022.
This year's symposium will focus on Packaging Technologies Enabling the New Normal, and will feature five technical tracks plus an interactive poster session. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, high performance computations, automotive, industrial, defense/space, medical electronics markets, and more. Professional development courses are also offered on October 3, prior to IMAPS 2022.
Visit booth #110 during October 4 to October 5 to learn about microelectronics packaging solutions from Palomar Technologies. Explore how the new Palomar 3880-II Die Bonder, Palomar 8100 Wire Bonder and SST Vacuum Reflow Systems can automate and improve packaging processes and productivity.