Industrial Electronics

Webinar: The great debate – Ball vs wedge bonding

10 January 2022

Why would a process engineer choose a wedge bonder over a ball bonder or vice versa? This has been the question of most process engineers because, generally speaking, the electrical characteristics of the package are affected by the method of wire bonding. However, there are cases where certain packages have physical constraints such as temperature limitation (low heat or no heat applications), such as the use of aluminum wire instead of gold, use of ribbon instead of wire and fine pitch application.

Knowing which bonding method to choose is important to a successful package. This webinar hosted by Palomar Technologies will cover the applications for ball bonding and wedge bonding and what requirements need to be met for a successful bond.

Topics to be discussed include: When fine wire bonding is best considered, when wedge bonding is the best solution and other technical aspects that need to be considered.

Register for this free Palomar Technologies webinar, scheduled to be held February 23, 2022, at 8 am PST.

To contact the author of this article, email engineering360editors@globalspec.com


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