Intel Corp. has delivered its first multi-chip package (MCP) prototypes to the U.S. Department of Defense (DoD), about six quarters ahead of schedule.
Developed under Intel’s state-of-the-art heterogeneous integrated packaging (SHIP) program, the prototypes use the company’s industry partnerships and core technology in the development of new chiplet ecosystems.
Intel claims this is a significant step in access microelectronics packaging and create pathways to modernization for the DoD. The goal is to help the government agency diversify its supply chain and protect its intellectual property while supporting ongoing semiconductor R&D in the U.S. and preserving capabilities domestically.
The MCP capabilities deliver up to 10 times the size, weight and power advantage compared to traditional packaging types. Additionally, it helps with deployment speed when needing to transform and transition defense systems.
The SHIP program
The SHIP program is designed to provide the U.S. government with Intel’s heterogeneous packaging technologies. This includes:
- Multi-die interconnect bridge (EMIB)
- 3D Forveros
- Co-EMIB
The technology allows the defense industrial base to leverage these advanced semiconductor packages and chiplet libraries as well as to specify, prototype, build, test and incorporate advanced devices into field equipment.
The next steps in the SHIP program are to improve the chipset size, weight, power and performance as well as to accelerate the advancement of interface standards, protocols and security.
