Semiconductor manufacturer Qorvo has been awarded a contract by the U.S. government to create a state-of-the-art (SOTA) heterogeneous integrated packaging (SHIP) RF production and prototyping center.
SHIP will ensure that microelectronics packaging expertise and leadership is available for both U.S. defense contractors and commercial clients that require design, validation, assembly, test and manufacturing of next-generation RF components.
The other transaction agreement (OTA) worth up to $75 million was awarded to Qorvo by the Naval Surface Warfare Center (NSWC), Crane Division.
Under the SHIP program, Qorvo will design and deliver the highest levels of heterogeneous packaging integration. This is essential to meet the size, weight, power and cost (SWAP-C) requirements for advanced phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.
Qorvo’s U.S.-based capabilities include advanced manufacturing, packaging and testing for both high- and low-power applications ranging from DC to 100 GHz. The company holds a Defense Microelectronics Activity (DMEA) Category 1A trusted source certification for package assembly, test and wafer foundry services at its Richardson, Texas, location.
Similarly, the DMEA awarded American semiconductor foundry GlobalFoundries a $400 million ceiling increase under a recent contract modification. It will continue to provide the Department of Defense access to microelectronic products and trusted processes.
The modification brings the face value of a previously awarded contract from $714.6 million to $1.11 billion.
DMEA issued the contract action due to an increased interest among government customers for leading-edge technology offerings and lifetime orders for end-of-life technology.