Critical Communications

CES 2020: MediaTek unveils new 5G chipset for next-generation smartphones

08 January 2020

MediaTek has introduced a new 5G chipset designed for next-generation mid-range 5G smartphones at this week’s CES 2020 being held in Las Vegas.

The Dimensity chipset is a series of system-on-chips integrated with 5G modems in a single chip that is manufactured on 7 nm process technology. The first chipset in the series is expected to launch in the first half of this year.

The chipset supports 5G with two-carrier aggregation for 30% wider high-speed layer coverage, more seamless 5G handover and higher average throughput performance compared to other solutions, MediaTek claims.

The chipset will support both standalone and non-standalone sub-6 GHz networks with multi-mode support for every cellular connectivity generation from 2G to 5G. The chipset also supports dynamic spectrum sharing and new services such as voice over new radio (VoNR).

Inside the Dimensity chipset is four ARM Cortex-A76 cores operating up to 2 GHz, with four power-efficient ARM Cortex-A55 cores operating at up to 2 GHz. The chipset includes a 1000-class GPU IP combined with MediaTek’s HyperEngine and support for up to 64 MP camera sensors or large multi-camera options such as 32+16 MP dual cameras. It can also support full HD+ displays up to 90 Hz refresh rate and artificial intelligence autofocus, auto exposure, noise reduction and multi-frame 4K video HDR.

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