While Qualcomm’s Snapdragon mobile processors and chipsets have become ubiquitous in most smartphones, there are other chipsets on the market to compete in the burgeoning 5G smartphone market.
One such system-on-chip (SoC) is from MediaTek called the Dimensity 820. This SoC features four ARM Cortex-A76 cores at 2.6 GHz in its octa-core CPU, an ARM Mali G57 GPU graphics plus HyperEngine 2.0 enhancements for mobile game support, artificial intelligence, multimedia and imaging applications.
The Dimensity 820 integrates a 5G new radio sub-6 GHz modem into a single-chip as well as MediaTek’s UltraSave technologies such as network environment detection and OTA content awareness. The 5G modem uses dynamic bandwidth part (BWP) adaption and connected mode discontinuous reception (C-DRX) power-saving technologies.
Other features include the MediaTek APU 3.0 an artificial intelligence camera, HyperEngine 2.0 for enhanced gaming, Imagiq 5.0 for HDR-native image signal processor (ISP) support of up to four concurrent cameras and up to 80 MP sensors and multi-frame 4K HDR video. The SoC also supports dual SIM, dual standby and voice over new radio services on both SIMs.
MediaTek designed the Dimensity 820 for sub-6 GHz networks and smartphones in Asia, North America and Europe.