Mobile Devices

Teardown: Motorola Moto Z3

14 October 2019
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

The Motorola Moto Z3 is ready for upgrading to Verizon's 5G network through the use of a snap-on accessory designed for millimeter-wave connection, the 5G Moto Mod (sold separately). A CES 2019 Innovation Awards honoree, this groundbreaking smartphone also offers dual depth-sensing cameras and Google Lens tools such as text translation and object recognition.

The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Motorola Moto Z3. Source: IHS MarkitMotorola Moto Z3. Source: IHS Markit

Summary points

  • World's first 5G-upgradable smartphone
  • Qualcomm Snapdragon 835, Octa-Core, 2.45GHz, MSM8998
  • 4GB LPDDR4X SDRAM, 64GB UFS NAND
  • 6.01" AMOLED, 2160 x 1080 w/On-Cell Touch
  • Dual 12MP (Mono) + 12MP (RGB) Primary Camera, 8MP Secondary Camera

Motorola Moto Z3. Source: IHS Markit [click to enlarge]Motorola Moto Z3. Source: IHS Markit [click to enlarge]
Target market:
Mass market

Released: August 2019

Pricing: MSRP $480.00

Availability: Worldwide

Total manufacturing cost: $231.91 (including direct materials and manufacturing)

Motorola Moto Z3 camera components (top row, primary camera module; bottom row, secondary camera module). Source: IHS MarkitMotorola Moto Z3 camera components (top row, primary camera module; bottom row, secondary camera module). Source: IHS Markit

SUNNY OPTICAL TECHNOLOGY CO LTD, Y12N06D-2, Primary Camera Module, Dual, 12MP Monochrome + 12MP RGB, Stacked BSI CMOS (Exmor RS), Auto Focus Lens, 6P Lens (Mono) & 6P Lens (RGB). Teardown at top left shows:

  • (1, 2) Copper foil
  • (3) GIANTEC SEMICONDUCTOR INC, EE PROM
  • (4, 5) SONY CORP, IMX386, lmage Sensor, 12MP, Stacked BSI CMOS (Exmor RS), 1/2.9" Format, 1.25um x 1.25um Pixel Size, 4.96mm x 3.72mm Active Area

SUNNY OPTICAL TECHNOLOGY CO LTD, A8S020, Secondary Camera Module, 8MP, ISOCELL CMOS, 1/4" Format, Fixed Lens, 4P Lens. Teardown at top right shows:

  • (1) SAMSUNG SEMICONDUCTOR INC, S5K4H7, lmage Sensor, 8MP, ISOCELL CMOS, 1/4" Format, 1.12um x 1.12um Pixel Size, 3.66mm x 2.74mm Active Image Area

Motorola Moto Z3 main PCB (bottom); antenna and connector direction. Source: IHS MarkitMotorola Moto Z3 main PCB (bottom); antenna and connector direction. Source: IHS Markit

Major components

  • Apps / Baseband Processor, Multi-Mode, Snapdragon 835, Octa-Core 64-Bit Kryo 280 2.45GHz CPU, Quad-Core 2.35GHz + Quad-Core 1.9GHz, Adreno 540 GPU, 10nm FinFET, PoP - MFR: QUALCOMM - MPN: MSM8998 - (Qty: 1)
  • SDRAM, LPDDR4X-3733, 4GB, PoP - MFR: SAMSUNG SEMICONDUCTOR INC - MPN: K3UH5H50MM-NGCJ - (Qty: 1)
  • Enclosure, Main, Midframe, Machined Aluminum, Anodized, w/ Injection Molded Plastic, w/ Diamond Cut Edges, w/ 8 Gold Plated Metal Contact Tabs & 33 Spot-Welded Points, w/ 14 Metal Tabs & Laser Etched - (Qty: 1)
  • 6.01" Diagonal, AMOLED, LTPS, 2160 x 1080, On-Cell Touch, Pentile Matrix, 14.8g - MFR: SAMSUNG DISPLAY CO LTD - MPN: AMS601NT12 - (Qty: 1)
  • Primary Camera Module, Dual, 12MP Monochrome + 12MP RGB, Stacked BSI CMOS (Exmor RS), Auto Focus Lens, 6P Lens (Mono) & 6P Lens (RGB) - MFR: SUNNY OPTICAL TECHNOLOGY CO LTD - MPN: Y12N06D-2 - (Qty: 1)
  • 10-Layer, FR4/RCF HDI, Any Layer Stacked Via, Lead-Free - MFR: COMPEQ MANUFACTURING CO LTD - (Qty: 1)
  • Flash, UFS NAND, 64GB, MLC - MFR: SAMSUNG SEMICONDUCTOR INC - MPN: KLUCG4J1ED-B0C1 - (Qty: 1)
  • RF Transceiver, Multi-Mode, Multi-Band, GSM/EDGE/CDMA 1X/EV-DO/TD-SCDMA/WCDMA/LTE, w/ GPS/GLONASS/BEIDOU/GALILEO, 28nm - MFR: QUALCOMM - MPN: WTR5975 - (Qty: 1)
  • Battery Pack, Li-Polymer, 1-Cell, 3.8V, 2820mAh, 10.7Wh, w/ 2 Discrete Wires & 1 2-Position Pin Socket Connector - MFR: SCUD (FUJIAN) ELECTRONICS - MPN: JS40 - (Qty: 1)
  • Power Management IC - MFR: QUALCOMM - MPN: PM8998 - (Qty: 1)


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