Internet Enabled Consumer Devices

Teardown: Huawei Mate 10

19 November 2018
The following is an overview of a teardown analysis conducted by IHS Benchmarking.
The Huawei Mate 10. Source: IHS Markit

Co-engineered with German camera company Leica, the Huawei Mate 10 meets Google's benchmarks for Android Enterprise Recommended status. Features include the Kirin 970 processor, designed to boost AI efficiency and performance; the smartphone's neural-networking processing unit (NPU) also operates independently from standard cloud-based processing, ensuring privacy. Smart battery management learns from user behaviors in order to intelligently allocate resources and maximize battery life.

The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

The Huawei Mate 10: final assembly, main enclosure. Source: IHS MarkitThe Huawei Mate 10: final assembly, main enclosure. Source: IHS Markit

Summary points:

  • HiSilicon Kirin 970, octa-core, 2.4 GHz, Hi3678
  • 5.9 in IPS TFT-LCD, 2,560 x 1,440 w/in-cell touch, TDDI
  • 64 GB UFS NAND, 4GB LPDDR4X
  • Dual (20 MP Mono + 12 MP RGB) primary camera, 8 MP secondary

Target market: Mass market

Release date: November 2017

Pricing: Approximately $588 USD (MSRP)

Total manufacturing cost: $253.08 (including direct materials and manufacturing)

The Huawei Mate 10: primary camera module, top. Source: IHS MarkitThe Huawei Mate 10: primary camera module, top. Source: IHS Markit

Major components:

  • Apps/baseband processor, multi-mode, Kirin 970, quad-core ARM cortex-A73 2.36 GHz CPU, quad-core ARM cortex-A53 1.8 GHz CPU, Mali-G72 MP12 GPU, 10 nm FinFET, PoP MFR: HiSilicon — MPN: Hi3678 — (Qty: 1)
  • 5.9 in diagonal, TFT LCD, LTPS, IPS, 2,560 x 1,440, in-cell touch, TDDI, 24.1g — MFR: Japan Display Inc. — (Qty: 1)
  • Primary camera module, dual, 20 MP monochrome + 12 MP RGB, BSI CMOS, auto focus lens, optical image stabilization, 6P lens (mono) and 6P lens (RGB) — (Qty: 1)
  • SDRAM, LPDDR4X-3733, 4 GB, PoP — MFR: Samsung Semiconductor Inc. — MPN: K3UH5H50MM-EGCJ — (Qty: 1)
  • Enclosure, main, midframe, machined aluminum, anodized, glossy, w/ injection molded plastic, w/ 11 gold plated stamped metal contacts and 58 spot-welded points, w/ four pressed-in threaded brass inserts and 10 metal tabs — (Qty: 1)
  • Flash, UFS NAND, 64 GB, MLC — MFR: Samsung Semiconductor Inc. — MPN: KLUCG4J1ED-B0C1 — (Qty: 1)
  • Enclosure, main, bottom cover, 3D curved tempered glass, three holes, w/ multi-color film — (Qty: 1)
  • Battery pack, Li-polymer, one-cell, 3.82 V, 3900 mAh, 14.9 Wh, w/ flex PCB and board-to-board connector — MFR: Huizhou Desay Battery Co. Ltd. — MPN: HB436486ECW — (Qty: 1)
  • Fingerprint sensor module, area type, glass cover w/ machined metal frame — (Qty: 1)
  • Bluetooth/FM/WLAN, single chip, IEEE 802.11 a/b/g/n/ac, 2.4 GHz/5 GHz, 2 x 2 MIMO, Bluetooth v4.2, FM radio — MFR: Cypress Semiconductor Corp. — MPN: BCM43596XKUBG — (Qty: 1)

The Huawei Mate 10: main PCB, bottom. Source: IHS MarkitThe Huawei Mate 10: main PCB, bottom. Source: IHS Markit



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