Industrial Electronics

Cinch Connectivity Solutions announces availability of the CIN:APSE stacking connectors

09 January 2019

Cinch Connectivity Solutions announces the commercial availability of its CIN:APSE stacking connector series.

CIN:APSE solderless, high-density, stacking interconnects are for board-to-board, flex-to-board and CIN APSE. Source: Cinch Connectivity SolutionsCIN APSE. Source: Cinch Connectivity Solutionscomponent-to-board applications. CIN:APSE stacking connectors are found in applications where a mezzanine style PCB layout is utilized to reduce space and weight.

The CIN:APSE 1 mm pitch accommodates high-density circuits between boards, and its mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing. The mechanical contacts also reduce the need for soldering and subsequent inspection. CIN:APSE is one the most widely implemented solderless, high-speed interconnects in the industry and are found on military, aerospace and satellite applications worldwide.

For more information on the CIN:APSE stacking connector, please visit its webpage. CIN:APSE stacking connectors are also available through distributors, Digi-Key, Mouser and Newark.

To contact the author of this article, email engineering360editors@globalspec.com


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