Cinch Connectivity Solutions announces the commercial availability of its CIN:APSE stacking connector series.
CIN:APSE solderless, high-density, stacking interconnects are for board-to-board, flex-to-board and component-to-board applications. CIN:APSE stacking connectors are found in applications where a mezzanine style PCB layout is utilized to reduce space and weight.
The CIN:APSE 1 mm pitch accommodates high-density circuits between boards, and its mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing. The mechanical contacts also reduce the need for soldering and subsequent inspection. CIN:APSE is one the most widely implemented solderless, high-speed interconnects in the industry and are found on military, aerospace and satellite applications worldwide.