Industrial Electronics

Heilind Electronics Introduces TE Connectivity’s AmbiMate MS4 Sensor Module

10 October 2018

Heilind Electronics, a global distributor of electronic components and authorized distributor for TE Connectivity (TE), a global provider of connectivity and sensors, introduces TE’s AmbiMate sensor module (SM) MS4 series. TE’s AmbiMate SM provides an application-specific set of sensors on a single printed circuit board (PCB) assembly for easy integration into a host product, freeing design resources and accelerating time to market.

This pre-engineered, compact and cost-effective module features a core set of four sensors that perform Source: Heilind ElectronicsSource: Heilind Electronicsfunctions like the detection of motion and the measurement of light level, temperature and humidity - with options for sensing VOCs (volatile organic compounds), carbon dioxide and sound. All MS4 series sensor module parts offer the flexibility of sharing a common seven-position connection that allows designers to lay out a single PCB footprint accommodating all the available sensor configurations at production.

TE’s AmbiMate sensor modules report data via I2C (inter-integrated circuit) and an event pin to indicate motion or sound detection, enabling devices to report environmental data from the sensor module and make decisions based on the input. The modules are pin compatible, allowing designers the ability to add or remove sensors as needed, and are easily attached to the host board via a number of attachment options - with the smallest option being 29.46 mm x 16 mm. MS4 series modules operate from a 3.3 V supply and the design is optimized for maximum battery life.

The variety of sensors and small package size make the AmbiMate SM suitable for multiple indoor applications, including indoor lighting, thermostat and HVAC inputs and building automation networks.

Visit Heilind's website for more information about TE Connectivity’s AmbiMate Sensor Module Series.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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