United Microelectronics Corp. (UMC) and Xperi Corp. have formed an agreement to optimize and commercialize the Xperi’s ZiBond and DBI technologies for a range of semiconductors devices.
The companies said wafer-to-wafer and die-to-wafer bonding and 3D interconnect implementation will be employed to address applications in the mobile, consumer, automotive, communication, industrial and Internet of Things (IoT).
ZiBond is a low temperature homogeneous direct bonding technology that forms bonds between semiconductor wafers or die with same or different coefficients of thermal expansion. The technology is used in image sensors, MEMS and RF front-end devices.
The DBI technology is a temperature hybrid direct bonding technology that allows IC wafers or die to be bonded with fine pitch 3D electrical interconnect. This is suited for devices such as image sensors, DRAM, MEMS and RF devices.
