Tessera has announced the acquisition of Ziptronix, Inc. for $39 million in cash. The acquisition furthers the company’s advanced packaging capabilities, adding a low-temperature wafer bonding technology platform for 2.5D and 3D-IC solutions to semiconductor customers.
Ziptronix’s patented ZiBond direct bonding and DBI hybrid bonding technologies are important to Tessara’s ability to deliver scalable, low total cost-of-ownership manufacturing solutions for 3D stacking. Ziptronix’s IP is licensed to Sony Corporation for volume production of CMOS image sensors. Its technology is also relevant to the next-generation stacked memory, 2.5D FPGAs, RF Front-End and MEMS devices, among other semiconductor applications.
Tessera expects the annual market size to which this technology applies to exceed $15 billion by 2019. Ziptronix is a private company, founded in 2000 as a venture-backed spinoff of RTI International. Daniel Donabedian, president and CEO of Ziptronix states that the combined companies address rapidly expanding 2.5D and 3D-IC markets.
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