Home
-
MediaTek Gears Up for Wearables, IoT
MediaTek, best known as supplier of application processors for low-end and China market smartphones, is preparing to use that position to drive success in the wearables and Internet of Things markets.
-
Researchers Claim World's First 2-D Field Effect Transistor
Lawrence Berkeley National Labs scientists say the FET suffers no performance drop-off under high voltages, unlike conventional FETs made from silicon.
-
Cavium Goes 48-core With ARM Server SoC
Networking chip company Cavium has leapt ahead with a 64-bit ARM server SoC that includes 48 ARMv8-compatible cores.
-
Researchers Transform Infrared Light Into Graphene Plasmons
Researchers at CIC nanoGUNE, in collaboration with ICFO and Graphenea have shown that a nanoscale metal rod on graphene can capture IR light and transform it into graphene plasmons.
-
Samsung Pushes Vertical NAND to 32 Layers
3D-NAND pioneer Samsung has pushed the memory technology to 32-layers although the company has not yet revealed the storage capacity of its second-generation vertically-stacked memory.
-
Synopsys Augments IP Portfolio With New Initiative
No. 2 IP vendor augments portfolio with prototyping kits, software development kits and customized IP subsystems.
-
U.S. Manufacturing Growth Builds Momentum
The U.S. manufacturing sector in May expanded for the 12th consecutive month, according to the Institute of Supply Management.
-
ARM to Open Cortex-M CPU Design Center in Taiwan
ARM's first Asian design center for processor cores will focus on the Internet of Things and embedded device markets. ARM has also announced it is acquiring Irish EDA company Duolog.
-
Broadcom to Exit Cellular Baseband Chip Business
CEO Scott McGregor continues pruning Broadcom as he seeks out better margins and more profits for shareholders.
-
MediaTek Rolls Quad Core Tablet SoC
Device features full hardware support for the new H.265 video playback standard that and will be integrated into Alcatel’s Pixi 7 and 8 tablet.
-
Teardown: Siemens SIMATIC S7-200CN (CPU 226) PLC
The S7-200CN is the “mainframe” for Siemens’s line of micro-programmable logic controllers (Micro PLCs) for controlling a variety of automation applications.
-
PCB Book-To-Bill Remains Positive
North American printed circuit board shipments in April increased 1.6 percent compared to April 2013, but declined 12 percent from March 2014, according to Association Connecting Electronics Industries.
-
Researchers Extend 3-D Imaging Range for Consumer Apps
New technology said to remotely sense objects across distances as long as 30 feet, 10 times farther than what can be done with comparable current low-power laser systems.
-
Intel Rolls Connected Car Products
Hardware, software products aimed at providing vehicle manufacturers with the ability to offer a more connected and integrated automobile, and eventually, self-driving capabilities.
-
Seagate Buys LSI Flash Businesses from Avago
Seagate is moving to catch up with acquisitive rival Western Digital by spending $450 million on two SSD-related business divisions that have just arrived at Avago.
-
Small Systems with Big Functionality for the IoT
The emergence of the Internet of Things (IoT) and the new demands it makes on electronic devices is the underlying force driving SiP’s ascent.
-
Soitec Partners in China to Produce SOI Wafers
Soitec partnership called first step in building Chinese ecosystem. 300mm wafers not mentioned explicitly but could be key to China's adoption of FDSOI.
-
Intel Partners With Rockchip For Tablet Push
To help it get Atom-based system-chips designed into low-cost Chinese tablet computers Intel is partnering with an ARM processor cores licensee.
-
Molex Acquires Italian Connector Company
Molex European Holdings BV has acquired the heavy-duty connector business of Westec s.r.l.
-
WSC Calls for Expansion of ITA
Semiconductor industry leaders have reached agreement on policy proposals designed to strengthen the chip industry.
