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Wi-Fi HaLow board launches for long-range IoT
Morse Micro and Gateworks team to bring this connectivity to industrial sectors.
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Micron debuts fast DRAM memory for AI gains, power savings
The memory will accelerate AI applications on smartphones.
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Asahi Kasei launches dry film for smarter chip packaging
The Sunfort series will enable fine wiring formation in panel-level packages and similar applications.
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PowerScan 9600 RFID Series — Revolutionizing industrial scanning
The handheld unit integrates high-performance barcode scanning with embedded ultra high frequency (UHF) radio frequency identification (RFID) tag reading.
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Space chip revenue to nearly double by 2030
Satellites will continue to be the leading applications for these semiconductors.
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GF plans $16B reshoring effort to rebuild US chipmaking
New investments in New York and Vermont, partnering with tech giants and the Trump Administration to bring advanced chip production back to American soil.
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Next-generation Wireless InSite introduces innovative time-based mobility of RF systems, lunar propagation and wideband ray-tracing
The updated software offers advanced capabilities including time-based mobility, lunar propagation modeling and wideband ray-tracing with S-parameter outputs.
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Menlo Micro shares strategic roadmap for the future at IMS 2025
Experience interactive demos of the Ideal Switch platform six new products that are delivering transformative impact in many radio frequency, high-speed-digital and power applications.
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Report: Huawei assembles homegrown chip ecosystem amid US sanctions
More than 60 companies in the semiconductor supply chain have been invested in.
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AI and machine learning energize predictive maintenance in battery systems
Machine learning and artificial intelligence have revolutionized battery diagnostics by sifting through volumes of data to provide more precise predictions about a battery's health and lifespan.
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Moog missile CAS performs flawlessly during successful test of Leidos Black Arrow SCM for USSOCOM
Leidos integrated Moog CAS shipsets into Black Arrow, an affordable mission-adaptable delivery platform in the 200-lb class which is designed to support both kinetic and non-kinetic missions.
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The fallout of Wolfspeed’s potential bankruptcy
Renesas plans to exit the SiC market and leaves open-ended questions about investments and funding.
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IDC: Tariffs, uncertainty to hinder smartphone growth in 2025
The sector will only manage 0.6% year-over-year expansion in 2025.
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Airbus next-generation Skynet satellite reaches major milestone
The U.K.’s next-generation military communications satellite — Skynet 6A — has successfully completed the coupling of its communications and service modules.
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Soitec, PSMC team on 3D chip stacking substrates
The new agreement brings TLT-ready 300 mm wafers to enable compact, energy-efficient 3D chip designs.
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Broadcom’s Tomahawk 6 breaks 100 Tbps barrier
Built for AI networks, it is being called a world’s first.
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Mixed Signal Devices introduces femtosecond-level jitter solutions for AI, 5G, radar
Mixed Signal Devices’ portfolios can withstand extreme heat or voltage.
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Infineon debuts JANS-certified radiation-hardened GaN transistors
The series is targeted at space vehicles, probes and manned discovery.
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Samtec Si-Fly LP, low-profile cable assemblies capable of residing under IC cooling hardware
These cable assemblies target data center, artificial intelligence and other applications where z-axis height is limited near the IC package.
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Menlo Micro unveils updated high-performance MM5622 fully integrated loopback solution at SWTest Conference
The high-speed loopback relay opens more applications and provides more performance margin for dozens of high-speed digital interfaces.
