MEMS and Sensors

Micron debuts fast DRAM memory for AI gains, power savings

05 June 2025
Micron’s LPDDR5X memory allows smartphones to be faster and offers a smoother experience for users. It also boosts battery life. Source: Micron

Micron Technology has rolled out what it claims is the industry’s fastest low-power double data rate 5X (LPDDR5X) memory with a speed grade at 10.7 gigabits per second (Gbps) designed to accelerate artificial intelligence (AI) applications on flagship smartphones.

Micron said the memory allows smartphones to operate faster along with a smoother mobile experience. It also enables a longer battery life with 20% power savings. This will allow smartphones to do more data-intensive workloads such as AI-power translation or image generation.

Additionally, the 1γ-based LPDDR5X is the first mobile memory to use advanced extreme ultraviolet (EUV) lithography and builds on the February sampling of the 1γ-based DDR5 memory for next-generation microprocessors for data centers and enterprise segments. It also uses high-K metal gate technology for improved transistor performance and EUV lithography for enhanced bit density.

Micron said it evaluated mobile AI response times from large language model Llama 2 based on the 1γ (1-gamma) node-based LPDDR5X memory compared to its 1β (1-beta) LPDDR5X’s 7.5 Gbps bandwidth. The company found:

  • 30% faster responses in location-based restaurant recommendations.
  • 50% faster results when translating voice inquiries.
  • 25% faster responses when requesting car purchase recommendations.

Why it is needed

According to Micron, demand for compact solutions for smartphone designs is accelerating. A small form factor unlocks more possibilities for smartphone OEMs to design thinners and foldable phones.

Additionally, energy-intensive mobile AI workloads are increasing the processing needs of smartphones, tablets and laptops.

Any memory power savings or processor savings for power consumption are ideal for these next-generation smartphone designs, Micron said.

To contact the author of this article, email PBrown@globalspec.com


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