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Qualcomm revolutionizes the future of AI and connectivity with groundbreaking innovations at MWC Barcelona
Advancements in on-device artificial intelligence (AI), intelligent computing and wireless connectivity were showcased.
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APEC 2024: How to improve switching in solid-state relays
Infineon launches a family of iSSI drivers that use coreless transformer technology.
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Rochester Electronics offers SLC and eMMC NAND storage solutions
NAND FLASH non-volatile memory solutions cater to the needs of mature and legacy systems.
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MWC 2024: SolidRun unveils first AMD Ryzen-based com module
The platform is used for a range of networking and edge applications.
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Video: Watch a 5G holographic concert at MWC 2024
Telefónica and Ericsson showcase how technology, music and art can be accomplished using 5G networks.
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Attend Control Automation Day 2024
Get ready for this highly interactive online industry event geared for control and automation engineers.
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US on track to produce about 20% of logic chips by 2030
Plus, the CHIPS Act has twice as many requests for funding than what’s available.
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Rohde & Schwarz and MediaTek to showcase 5G NTN-NR Rel.17 connection at MWC 2024
The companies will demonstrate a 5G non-terrestrial network (NTN) new radio (NR) connection based on the latest 3GPP Release 17 specifications.
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MWC 2024: Oppo unveils prototype aR glasses
The glasses provide information that overlays the physical environment.
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Power Integrations launches InnoMux-2, a new switcher IC family with multiple, independently regulated outputs
New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50%.
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A real marvel when it comes to distance
Thanks to time-of-flight technology, this compact diffuse sensor achieves an operating range of up to 2 m, detects the presence of objects and transmits measurement values.
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TSMC’s first Japanese fab opens
The second fab will open in 2027.
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Vishay Intertechnology IGBT power modules in redesigned INT-A-PAK package reduce conduction and switching losses
New half-bridge insulated-gate bipolar transistor (IGBT) power modules are designed to lower conduction or switching losses in high current inverter stages for transportation, energy and industrial applications.
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ST Microelectronics expands into 3D depth sensing with latest time-of-flight sensors
The company announced a direct time-of-flight (ToF) 3D light detection and ranging module with 2.3k resolution and an early design win for the world’s smallest 500k-pixel indirect ToF sensor.
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Keysight demonstrates 6G neural receiver design flow in collaboration with NVIDIA at Mobile World Congress 2024
External channel models simulated by NVIDIA Sionna are emulated using Keysight equipment to create custom end-to-end system.
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Rohde & Schwarz and SmartViser partner to demonstrate test solutions for new EEI regulation
The partners developed a tailored solution for testing compliance with a new EU Energy Efficiency Index (EEI) label for smartphones and tablets.
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MWC 2024: 7th generation 5G modem unveiled by Qualcomm
The Snapdragon X80 will include an AI processor with integrated NB-NTN satellite communication support.
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LPWA chipset available from Sony Semiconductor
The module can be used in asset tracks or smart utility meters.
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MWC 2024: Skyworks, Samsung collaborate for next-generation 5G modems
Skyworks’ SKY5 transceiver-to-antenna RFFE module will be integrated into these platforms.
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A sneak peek into Infineon's latest technologies at APEC 2024
Attendees can expect a sensory overload of presentations on power electronics innovations that will electrify their imagination, including Infineon’s new line of power management devices.
