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Onsemi introduces 7th gen IGBT based intelligent power modules to reduce energy consumption in heating and cooling
These modules enable more efficient energy conversion and better performance for three-phase inverter drive applications.
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Rohde & Schwarz first to test 5G eCall interoperability of Quectel’s 5G module with its wideband radio communication tester
Quectel Wireless Solutions and Rohde & Schwarz successfully validated Quectel’s innovative 5G eCall module, part of the AG56xN series of automotive modules.
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TechInsights Teardown: Google Pixel Fold
A partial deep dive into the foldable smartphone.
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ECIA: Strong momentum for electronic components to start 2024
And February will continue growth.
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Cambridge GaN devices addresses challenges of data centers and more at APEC 2024
Presentations will address how GaN can play a part in supporting the exponential growth in power demanded by data centers as the use of artificial intelligence proliferates.
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Rohde & Schwarz collaborates with Sony Semiconductor Israel to reach milestones for NTN NB-IoT roll-out
The collaboration achieved the industry’s first 3GPP Rel. 17 Non-Terrestrial Networks Narrow Band-Internet of Things (NTN NB-IoT) radio frequency performance verification.
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Introducing qdPrime: Revolutionizing DisplayPort testing with enhanced capabilities
The software simplifies testing, ensuring performance and improving interoperability.
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Goepel Electronic brings AR to inspection tasks
The company’s MultiEyeS plus AOI module is used in industrial tasks previously served by a manual approach.
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Emerson’s new compact, rugged PC built to connect industrial floor to cloud
The industrial computer delivers high-performance computing for industrial edge data visualization applications.
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New InGaAs camera: High resolution, small pixel and low readout noise
The camera functions with sensitivity in the visible to near infrared region from 400 nm to 1,700 nm.
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Tester module built for data center transition to OpenZR+ standard
Anritsu’s Network Master Pro is a handheld tester for multiple protocols.
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MSM II AE Metal Line indicators are made of high-grade stainless steel
Like the new MSM II switch family, the indicator version without switching function is available in point, ring or entire surface area illumination.
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Live demo of NR+ 5G coming to Hannover Messe 2024
Four companies will showcase the technology for IIoT applications.
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Triad Micro Devices takes flight for aerospace and defense excellence
The company specializes in cutting-edge, integrated and high-reliability analogue and mixed-signal solutions for terrestrial and space applications.
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Building AI-first autonomous vehicles
ARM and Nuro sign a multi-year agreement for next-generation transportation.
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One-box SSA portfolio for test and analysis
Keysight’s technology offers a DDS source and cross-correlation channels.
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Microchip unveils SiC gate driver solution
Microchip unveils a new offering to meet the demand of widespread electrification.
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Small portable oscilloscope series built for speed
Pico Technology unveils mixed-signal oscilloscopes for a wide range of testing.
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New LEMO product family portfolio simplifies selection process
The portfolio highlights core series organized into six distinct families based on shared functionality and specific market applications.
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Infineon unveils Bluetooth module for LE-LR use cases
This includes IIoT, smart home, asset tracking, beacons and healthcare.
