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Infineon to begin final construction phase on Dresden fab
Manufacturing is slated to begin in 2026.
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Apollo to take 49% equity interest in Intel’s Fab 34
It is the second such agreement with an asset management vendor.
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xMEMS launches 2 solid-state MEMS speaker reference designs
The units are for TWS earbuds and full range IEMs.
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Raspberry Pi gets a boost in AI capabilities
The new kit is a collaboration with AI accelerator vendor Hailo.
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So small, so ingenious: 5 MP autofocus camera available in a practical starter set
This tiny camera delivers consistently sharp images and videos from a distance of just 10 cm.
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Imec and AMSL to open High NA EUV lithography lab
The lab will provide access to prototype scanner, processing and metrology tools.
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Innodisk expands Edge AI applications and intelligent solutions at COMPUTEX2024 with new brand strategy
Key highlights include the industry's pioneering CXL 2.0 memory expansion, E3.S SSD and innovative MIPI over Type-C camera technology for machine vision.
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Laser marking of verSI product on metal shells
AirBorn is transitioning from ink marking to laser marking for some of its connector products.
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A quick look at ultrasonic sensors
Given the wide range of ultrasonic sensors available today, each boasting unique technical specifications, it is important to understand the fundamentals of these devices before selecting one for a particular application.
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Vishay Intertechnology adds pick and place friendly SMD lead bending option for AC05 and AC05-AT 5 W cemented, axial-leaded wirewound resistors
The WSZ lead form allows devices to bed used as surface-mount device components to reduce assembly costs.
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ODU turns testing to excellence at ATE Europe
The company will present precise connectors for mating and docking for a range of demanding automotive test and measurement applications.
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How Malaysia is gearing up to be the next big chip hub
The government is investing multiple billions and training 60,000 engineers.
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Smartphone market to rebound in 2024
Android growth in emerging markets will fuel recovery.
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BenQ Group at 2024 COMPUTEX Taipei
The BenQ Group seeks to enhance the sustainability of the 2024 COMPUTEX event in Taipei.
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Global tracking and telematics Click board from MikroE has extensive network compatibility
The u-blox module supports 14 LTE bands, four GSM/GPRS bands and integrated GNSS for precise global tracking.
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Lilium to sell 4 air taxis to UK helicopter vendor
The agreement also includes a reservation for an additional 12 aircraft.
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AI chip revenue to hit $71 billion this year
The growth will be driven by demand for generative AI in data centers.
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AEWIN amazes COMPUTEX2024 with AI-powered cybersecurity
The company will present high performance computing servers and network appliances for smart cybersecurity, edge artificial intelligence and internet of things applications.
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NHTSA investigating Waymo over robotaxi accidents
It is the third autonomous vehicle vendor to come under investigation recently.
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T-Mobile expands 5G network with UScellular acquisition
The deal will reach millions of users in rural areas.
