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TechInsights Teardown: Samsung Galaxy Z TriFold

24 July 2026

The three display Samsung Galaxy Z TriFold smartphone can be folded into a much larger screen display for entertainment or multi-tasking. Source: TechInsights The three display Samsung Galaxy Z TriFold smartphone can be folded into a much larger screen display for entertainment or multi-tasking. Source: TechInsights

Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of the Summary — Samsung Galaxy Z TriFold, click here.

The first foldable phone was introduced in October of 2018 by Royole. It was called the FlexPai and it beat Samsung to the market by a few months. While that company gets the credit for rolling out the first of these devices, it is Samsung that is credited for making foldable phones popular.

Since 2019, the Korean electronics giant has been making foldable phones as a alternative to its Samsung Galaxy flagship. These are much larger phones that have a second screen that can fold open so a user can watch a movie on a larger screen or multi-tasking from screen-to-screen.

The Samsung Galaxy Z TriFold takes it a step further with three screens that folds out to make an even larger phone. This smartphone contains 16 GB of mobile LPDDR5X SDRAM and 512 GB 3D TLC V-NAND flash from Samsung and the Qualcomm Snapdragon 8 Elite applications/baseband processor.

The following is a partial deep dive into the smartphone conducted by TechInsights.

Target market: Consumer

Availability: Worldwide

Price: $2,500

Released: January 2026

The main board found inside of the Samsung Galaxy Z TriFold smartphone. Source: TechInsightsThe main board found inside of the Samsung Galaxy Z TriFold smartphone. Source: TechInsights

Main board

The main board on the Samsung Galaxy Z TriFold smartphone includes the main memory from Samsung in the form of 16 GB mobile LPDDR5X SDRAM and 512 GB 3D TLC V-NAND flash. It also includes the main applications/baseband processor the Qualcomm octa-core Snapdragon 8 Elite. Other electronic components on the main board include:

  • Skyworks’ UHB LTE and 5G NR front-end module and MB/HB front-end module
  • ST Microelectronics’ six-axis MEMS accelerometer and gyroscope
  • Samsung’s camera power management IC and secure element chip
  • Qualcomm’s RF antenna tuner, RF transceiver, power management IC and dual SAW filter
  • Qorvo’s 2.4 GHz Wi-Fi front-end module and MB/HB front-end module
  • Maxscend’s GPS LAN
  • Murata’s SAW filter
  • SensorTek’s ambient light/proximity sensor
  • Diodes Inc.’s hall effect sensor
  • Convenient Power’s wireless power receiver
  • NXP Semiconductors’ eUSB 2.0 to 2.0 redriver
  • Analog Devices’ power management ICs
  • Wisol’s RxD front-end module and SAW filter
  • AKM Semiconductor’s three-axis electronic compass
  • Syntiant’s MEMS microphone
  • Bosch Sensortec’s digital barometric pressure sensor

(Learn more about logic chips on Globalspec.com)

The auxiliary board found inside of the Samsung Galaxy Z TriFold smartphone. Source: TechInsightsThe auxiliary board found inside of the Samsung Galaxy Z TriFold smartphone. Source: TechInsights

Auxiliary board

On the auxiliary board of the Samsung Galaxy Z TriFold include the following electronic components:

  • Qualcomm’s RF antenna tuner
  • STMicroelectronics’ six-axis MEMS accelerometer and gyroscope
  • SensorTek’s color, ambient light and proximity sensor
  • Texas Instruments’ Class-D audio amplifier
  • Analog Devices’ battery fuel gauge and buck-boost regulator
  • Silicon Mitus’ display power management IC and switched capacitor charger
  • Murata’s GPS LNA and SAW filter

(Learn more about audio chips on Globalspec.com)

The electronic components found on the 200 MP rear camera of the Samsung Galaxy Z TriFold smartphone. Source: TechInsightsThe electronic components found on the 200 MP rear camera of the Samsung Galaxy Z TriFold smartphone. Source: TechInsights

200 MP wide-angle rear camera

The electronic components found on the 200 MP wide-angle rear camera of the Samsung Galaxy Z TriFold include:

  • ST Microelectronics’ serial EEPROM memory
  • Samsung’s 200 MP BSI CMOS image sensor
  • AKM Semiconductor’s autofocus VCM drivers

(Learn more about image sensors on Globalspec.com)

Some of the electronic components found inside of the Samsung Galaxy Z TriFold smartphone. Source: TechInsightsSome of the electronic components found inside of the Samsung Galaxy Z TriFold smartphone. Source: TechInsights

Major components

  • $146.60 — Octa-Core Snapdragon 8 Elite Applications/Baseband processor — Qualcomm (Qty: 1)
  • $63.48 — Multichip memory — 16 GB Mobile LPDDR5X SDRAM — Samsung (Qty: 1)
  • $31.69 — Multichip memory — 512 GB 3D TLC V-NAND Flash, Memory Controller — Samsung (Qty: 1)
  • $29.50 — 200 MP BSI CMOS image sensor — Samsung (Qty: 1)
  • $10.98 — RF Transceiver + GPS — Qualcomm (Qty: 1)
  • $10.53 — Wi-Fi 7/Bluetooth 5.4 — Qualcomm (Qty: 1)
  • $6.76 — 12 MP BSI CMOS image sensor — Sony (Qty: 1)
  • $5.04 — 12 MP BSI CMOS image sensor — Sony (Qty: 1)
  • $5.04 — 12 MP BSI CMOS image Sensor — Sony (Qty: 1)
  • $4.76 — MB/HB front-end module — Skyworks (Qty: 1)


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