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Supply Chain
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ECIA: Strong sales sentiment continues for electronic components
The index rose 4.7 points, representing growth in February.
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APEC 2025: Power Integrations to showcase new switcher ICs
Experience the latest technical breakthroughs in PowiGaN devices in addition to motor driver, gate driver, power conversion and automotive product offerings.
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Imec becomes one of the first hubs to house ASML’s full tool suite
In agreement with the Dutch toolmaker, the companies will focus on semiconductor manufacturing research and sustainability.
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Embedded World 2025: MPU targets vision AI applications
The Renesas processor has 10 TOPS/W power efficiency and AI inference performance of up to 15 TOPS.
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Embedded World 2025: Altera unveils 3 FPGAs, software
The devices deliver up to 1.9 times higher fabric performance compared to previous generations.
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Semtech Introduces first LoRa Plus chip
The device supports both terrestrial and SATCOM networks in the sub-GHz, 2.4 GHz ISM bands and licensed S band.
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APEX Expo 2025: AI-powered software prevents defects in PCBs
Cybord’s RTI solution for electronic design identifies defective components from being assembled.
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Introducing the new k-Space Knowledge Base
A new resource for metrology and software engineers offers troubleshooting and best practices for thin-film metrology applications.
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Aetina introduces AI-powered Edge computing innovations at Embedded World 2025
Explore how Aetina’s innovative Edge artificial intelligence (AI) solutions are shaping the future of embedded systems.
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President Trump calls on ending CHIPS ACT
The act is designed to bring semiconductor manufacturing back to the U.S. domestically.
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Verizon expands IoT wireless services to 200 territories
The telecom signs agreements with Singtel and Skylo.
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Report: Intel delays Ohio fabs until next decade
This comes after delays to its Germany fabs and other cost-cutting measures.
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Accelerating radar SoC for ADAS proliferation
GlobalFoundries and Indie Semiconductor are collaborating on automotive electronic components.
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Marvell demos first 2 nm silicon IP
Produced on TSMC’s 2 nm process, the silicon is targeted at XPUs, switches and other cloud tech.
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TSMC doubles down on US chip growth with $100B boost
It will include the construction of three new fabs, two packaging factories and one R&D center.
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Solving key challenges in 224G interface packaging
An overview of the design challenges and possible solutions for 224G interfaces.
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Transforming biomanufacturing via miniaturized inline sensors
Imec’s tiny chip measures temperature, dissolved oxygen, electrical conductivity, glucose, lactate and even cell density in real-time.
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Synthetic diamond semiconductors: Smaller, faster, cooler
How the wide bandgap material could potentially be a boon for EVs, AI and renewable energy.
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Penn State to open chip lab
As part of the CHIPS Act, it will focus on thin films and device research.
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Embedded World 2025: RISC-V SoC IP collaboration
The Baya Systems and Semidynamics deal is looking to address challenges of AI and machine learning in emerging applications.
