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Industries
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Now at Mouser: Same Sky thermoelectric generators enable energy harvesting for low-power applications
The devices generate voltage or current output by utilizing the temperature difference between the hot or cold side of the modules.
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Mentech at APEC 2025: Discover the future of power electronics and communication technologies
The company will showcase magnetic components, power supplies and other high-performance products.
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APEC 2025: Power Integrations to showcase new switcher ICs
Experience the latest technical breakthroughs in PowiGaN devices in addition to motor driver, gate driver, power conversion and automotive product offerings.
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Video: HyperloopTT completes hyperloop study in Brazil
The goal is to help the country with cargo and shipping demand.
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Embedded World 2025: Micro Crystal highlights RTC innovations
Nicolas Moser discusses the trends happening in these IoT modules.
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Semtech Introduces first LoRa Plus chip
The device supports both terrestrial and SATCOM networks in the sub-GHz, 2.4 GHz ISM bands and licensed S band.
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Sager Electronics to exhibit at APEC 2025
Sager and MEAN WELL USA will share strategies to simplify design, reduce development time and enhance flexibility using off-the-shelf power supplies.
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Aetina and Axelera AI partner to advance computer vision at the edge
These artificial intelligence (AI)-optimized systems excel in complex tasks such as object recognition, multi-camera analysis and AI-driven decision-making while effectively addressing space and power constraints.
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AI and machine learning in motion control: Revolutionizing automation
A review of the effects of AI and ML in motion control, their benefits, real-world applications, and the challenges they present is of great value in priming the understanding of real-world events that are happening in real-time.
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Oxion 2.0 AI-driven RF design tool saves time and accelerates antenna integration success
Oxion applies machine learning to help designers of wireless products overcome the complex challenges surrounding antenna selection and design-in.
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Embedded at Embedded World 2025 (March 11-13)
Embedded World 2025 in Nurnberg, Germany, is about so much more than embedded systems. Each year this world-class tradeshow has grown to feature more communications and manufacturing technologies, as those increasing feature technologies like AI, industrial networks, edge computing, smart sensors and more.
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Rohde & Schwarz and Ceva present industry’s first test solution for the upcoming Bluetooth OTA UTP Test Mode
The solution enables over-the-air (OTA) controlled device testing, which will simplify measurements of small and highly integrated devices since no direct wired connection to the tester is needed.
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Anderson Power to debut new high-current connector at LogiMAT 2025
The Industrial Battery Connector is ideal for material handling applications like forklift charging, reach stacker charging and more.
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Creaform introduces the Pro version of its Scan-to-CAD application module
The application module is designed to streamline and enhance reverse engineering workflows with a more concise approach.
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Introducing the new k-Space Knowledge Base
A new resource for metrology and software engineers offers troubleshooting and best practices for thin-film metrology applications.
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Advancing electrocaloric research with FLIR thermal imaging at Queen’s University Belfast
The high-speed thermal imaging and advanced analysis tools enabled real-time observation of thermal fluctuations, providing deeper insights into material behavior.
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Aetina introduces AI-powered Edge computing innovations at Embedded World 2025
Explore how Aetina’s innovative Edge artificial intelligence (AI) solutions are shaping the future of embedded systems.
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Teledyne FLIR’s Black Hornet 4 nano-drone selected as winner of the Defense Innovation Unit’s Blue UAS Challenge
The uncrewed aerial system (UAS) represents the next generation of lightweight nano-drones, able to provide enhanced covert situational awareness to small fighting units.
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Verizon expands IoT wireless services to 200 territories
The telecom signs agreements with Singtel and Skylo.
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Apple unveils M3 Ultra processor for Macs
The CPU merges a GPU and links two M3 Max dies over 10,000 connections.
