Source: Mouser
Mouser Electronics, Inc. is now stocking the S71KL12SC0 HyperFlash™ and HyperRAM™ Multi-Chip Package (MCP) from Cypress Semiconductor. This memory subsystem solution combines NOR flash memory for fast-boot and instant-on with self-refresh DRAM for expanded scratch pad memory—all in a reduced footprint, low-pin-count package that is ideal for space-constrained and cost-optimized embedded designs.
The Cypress Semiconductor S71KL12SC0 HyperFlash and HyperRAM MCP is based on Cypress’ HyperBus™ interface. It enables faster systems with quicker response times in a richer user experience. The device features 512 Mbits of HyperFlash and 64 Mbits of HyperRAM. It is the optimum multi-package solution for designers looking to get a full high-performance memory subsystem with 70 percent fewer pins and a 77 percent smaller footprint in comparison to the existing SDRAM and Quad SPI solutions.
The S71KL12SC0 is housed in a 24-ball, FBGA package that shares a common footprint with discrete HyperFlash and HyperRAM products. The single-pad layout and common footprint enable engineers to support either a discrete device for the HyperFlash and HyperRAM MCP, offering the flexibility to change the design at any point in the product lifecycle without affecting the overall board layout. It saves valuable development time and minimizes cost.
Target applications of the S71KL12SC0 device include communications equipment, industrial applications and other high-performance internet of things (IoT) products.
To learn more about this new product, visit Mouser.
