Globalfoundries has licensed Amkor Technology Inc.’s copper pillar wafer bump technology in order to expand the pure-play foundry’s silicon-to-package portfolio.
The non-exclusive deal will transfer Amkor’s proprietary copper pillar wafer bump technology to the foundry and for a license to manufacture bump wafers based on the technology.
In a statement, Globalfoundries said it is looking to expand its integrated solutions for customers and a big part of that is its silicon-to-package component. With the Amkor equipment, Globalfoundries will be able to manufacture low profile and small area packaging devices, something that is required in the mobile device market.
David McCann, VP of packaging R&D at Globalfoundries, said in the statement that copper pillar bumping is “a critical part of bringing leading edge semiconductor devices to market” and having this technology in its fabs will enhance “our growing open ecosystems of manufacturing services and partners.”
The copper pillar technology supports 3D fine pitch memory interfaces and is utilized in a 2.5D packaging where fine pitch multi-die interconnects can reduce system costs and shorten time-to-market, Amkor said. The technology also supports die-to-die bandwidth between memory and logic devices, reduces power consumption and allows for high-speed interfaces when applied to analog and RF applications, the company said.
Globalfoundries has been ramping up its technology licensing in the last few months in order to enhance its leading-edge processes. In November, Globalfoundriessigned an agreement with Invecas in order to receive design services and IP support. And in October, the foundry made headlines by agreeing to pay $1.5 billion for IBM’s chip manufacturing business. The moves have been seen as a way to keep pace with the ever-growing technology demands being placed on the foundry industry as well as foundry leader TSMC.