SIA Honors Altera CEO

10 October 2014

Altera CEO John Daane will be awarded the 2014 Robert N. Noyce Award by the Semiconductor Industry Association (SIA) in recognition of his contributions to the U.S. semiconductor industry. Daane will receive the award at the SIA's annual awards dinner Nov. 13.

“For many years, John Daane has been one of the semiconductor industry’s strongest and most influential leaders,” said Brian Toohey, SIA president and CEO, in a statement. “John represents the heart and soul of our industry and the glue that hasstrengthened our association.”

Toohey added that, through his career, Daane has brought industry leaders together "to tackle challenges and advance core industry priorities.” Daane’s leadership hashelped the semiconductor industry create jobs, boost economic growth, andmaintain America’s global technology leadership, Toohey said.

Daane has served as Altera’s president and CEO since November 2000 and was named chairman of the board in May 2003. Prior to joining Altera, Daane worked at LSI logic for 15 years at various positions, most recently as executive vice president of LSI's communications products group.

Daane, who earned a bachelor’s degree from the University of California, Berkeley, said he was “honored and humbled to be selected by my friends and colleagues to receive this award.”

The Noyce Award is named in honor of semiconductor industry pioneer Robert N. Noyce, co-founder of Fairchild Semiconductor and Intel. Noyce and Jack Kilby are credited with inventing the integrated circuit.

Previous winners of the Noyce Award include: Kilby, Gordon Moore, Jerry Sanders, Robert Galvin and Craig Barrett among others.

Related links:

IHS Semiconductors & Components

News articles:

Chip Sales Rise Again

Bel Signs Licensing Deal with Cosel

Chip Sales Top Monthly Record

Chip Sales Maintain Record Pace

EMS Providers Beef up Design Capabilities to Attract OEMS

SIA: Semiconductor Sales Increased Nearly 9% in May

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Find Free Electronics Datasheets