ARM and Cadence Design Systems have expanded a deal for the Internet of Things and wearable devices to include Taiwan Semiconductor Manufacturing Corp.’s (TSMC) new ultra-low power (ULP) technology platform.
The collaboration allows for the development of IoT and wearable devices by providing ARM IP system integration along with Cadence’s integrate flow for mixed-signal design and verification leading to low-power designs in TSMC’s ULP 55, 40 and 28nm manufacturing processes.
TSMC new low power options could be used to reduce operating voltages by 20 to 30 percent, from previous norms at each node and thereby enable increases in the battery life of equipment by a factor of between 2 to 10.
Specifically, the deal will grant rights to deliver reference designs and physical design knowledge for integrating ARM Cortex processors, ARM CoreLink System IP and ARM Artisan physical IP as well as RF/analog/mixed-signal IP and embedded flash into an integrated flow for TSMC’s new ULP process technologies.
Nimish Modi, senior vice president of marketing and business development at Cadence, said in a statement TSMC’s ULP technology platform address the need for IoT devices’ low-power requirements. He added the collaboration with ARM “enable designers to develop and deliver new and creative IoT applications that take maximum advantage of ULP technologies.”
The expanded agreement builds on existing multi-year deals between the companies to optimize ARM technologies along with Cadence’s digital, mixed-signal and verification flows targeting TSMC’s 40nm, 28nm and 16nm FinFET process technologies.
"The reduction in leakage of TSMC's new ULP technology platform combined with the proven power-efficiency of Cortex-M processors can enable a vast range of devices to operate in ultra energy-constrained environments," said Richard York, vice president of embedded segment marketing, ARM, said in the same statement.
In other Cadence and ARM news, the companies also have signed a multi-year technology access agreement giving Cadence rights to existing and future ARM Cortex processors, ARM Mali GPUs, ARM CoreLink System IP, ARM Artisan physical IP and ARM POP IP. According to the companies, the deal will allow designers to access the latest ARM technologies in conjunction with Cadence’s design platforms for next-generation mobile, consumer, networking, storage, automotive and IoT.
Related links:
IHS Semiconductors & Components
News articles:
TSMC Tips Low-Voltage Processes Aimed at Wearables, IoT
ST Continues Allegiance to ARM’s Cortex Core with New MCU Family
ARM Doubles MCU Performance with Cortex-M7
