Combining a six-axis inertial measurement unit (IMU) and three-axis magnetometer with on-chip sensor fusion, TDK Corp.’s InvenSense PositionSense two-chip nine-axis sensor is now available through authorized electronics distributors.
The sensor is targeted at next-generation positioning accuracy and navigation for applications like wearables, hearables, robotics, drones, mobile devices and more.
The sensor is available in four hardware configurations that all include on-chip sensor fusion, gyro-assisted calibration and always-on sensing. These configurations include:
- ICM-45608 + ICT-15318 — A two-chip sensor for IoT applications with I2C/SPI/I3C support at 1.8 V VDDIO.
- ICM-45608 + ICT-15312 — A two-chip sensor for battery-powered and power-sensitive applications with I2C/SPI support at 1.2 V VDDIO.
- ICM-45689 + ICT-15318 — A two-chip sensor to improve headroom for high-dynamic motion and offer I2C/SPI/I3C support with 1.8 V VDDIO.
- ICM-45689 + ICT-15312 — A two-chip sensor to improve measurement headroom for high-dynamic motion and offer I2C/SPI support with 1.2 V VDDIO.
“When your device uses PositionSense, users are always on track and never lost — even in a city, field, factory, or location without a satellite connection,” said Joseph Bousaba, CEO of InvenSense, a TDK group company. “Whether for people using their smart glasses, watches, or phone for directions, or for a humanoid navigating a warehouse floor, our PositionSense sensor solution ensures highly accurate and reliable navigation for physical AI devices.”
