The Sony Xperia 1 VI smartphone. Source: TechInsights
Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of Sony Xperia 1 V XQ-DQ54 smartphone, click here.
Sony has long been a giant in the consumer electronics space, but it is not as influential or abundant in the smartphone market.
That said, the company still develops and sells smartphones, but the volume is nothing compared to the likes of Apple or Samsung. The Xperia 1 VI is Sony’s most recent handset that boasts a high battery life and natural-looking pictures.
The phone is powered by the ubiquitous Qualcomm Snapdragon 8 applications/baseband processor along with main memory from SK Hynix and Samsung.
The following is a partial deep dive on the Sony Xperia 1 VI conducted by TechInsights.
Summary
- 12 GB mobile SDRAM
- 12 MP BSI CMOS wide-angle
- 48 MP BSI CMOS wide-angle
- 6.45 inch AMOLED
Released: June 2024
Price: $1,659
Target market: Consumer
Availability: Worldwide
Main board
The main board of the Sony Xperia 1 VI contains the main processors and memory for operations of the smartphone such as the SK Hynix 12 GB mobile LPDDR5X DRAM and the Qualcomm octa-core Snapdragon 8 applications/baseband processor. Other electronic components found on the board include:
- Qualcomm’s power management ICs, clock buffer and camera power management chip
- Cirrus Logic’s Class-D audio amplifier and haptic driver
- STMicroelectronics’ six-axis MEMS accelerometer and gyroscope
- Bosch Sensortec’s digital barometric pressure sensor
- Nisshinbo Micro Devices’ Step-down DC/DC converter
- SK Hynix’s 246 GB 3D NAND Flash
- NXP Semiconductors’ SIM card interface level translator
- Ricoh’s 150 mA LDO regulator
- Samsung’s power management ICs
- Renesas’ power management ICs
(Learn more about sensor chips on Globalspec.com)
RF board
The RF board contains the electronic components needed for operation of the communication functions inside the Sony Xperia 1. The components include:
- Knowles’ MEMS microphone
- Qualcomm’s RF antenna tuner and front-end modules
- Murata’s Dual SAW filter
- Sony’s SPDT RF Switch
- Skyworks’ Low-band power amplifier module and quad-band GSM power amplifier
- Toshiba’s 500 mA/2.0 V LDO regulator
(Learn more about RF chips on Globalspec.com)
The auxiliary board found inside the Sony Xperia 1 VI. Source: TechInsights
Auxiliary board
Found inside the aux board of the Sony Xperia 1 VI are the following components:
- Qualcomm’s RF antenna tuner
- Knowles’ MEMS microphone
- NXP Semiconductors’ SD card level translator
(Learn more about MEMS devices on Globalspec.com)
Some of the components found inside the Sony Xperia 1 VI. Source: TechInsights
Major components
- $135.21 — Octa-core Snapdragon 8 applications/baseband processor — Qualcomm (Qty:1)
- $77.96 — 48/12 MP dual rear camera subsystem (Qty:1)
- $30.91 — 12 GB mobile LPDDR5X — SK Hynix (Qty:1)
- $26.05 — 12 MP persicope telephoto rear camera subsystem — Sony (Qty:1)
- $26.03 — 120 Hz display/touchscreen subsystem — Samsung (Qty:1)
- $21.11 — 256 GB 3D NAND flash — SK Hynix (Qty:1)
- $20.81 — Main enclosure (Qty:1)
- $12.03 — RF transceiver + GPS — Qualcomm (Qty:1)
- $11.69 — 12 MP front camera subsystem — Sony (Qty:1)
- $11.67 — WiFi 7/Bluetooth 5.3 — Qualcomm (Qty:1)
