Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of the Deep Dive Teardown of the Samsung Galaxy S23 FE SM-711B/DS Smartphone, click here.
When it comes to smartphones globally, Samsung is one of the biggest vendors. Like Apple, Samsung has its hands in all markets worldwide and has been rolling out new iterations of its flagship device every year or twice a year annually.
The Samsung S25 is the latest iteration of the series with improved memory and processing capacity as well as a whopping five cameras and includes multimodal AI agents. The smartphone includes a Snapdragon 8 Elite mobile platform for Galaxy chipset that has processing power for Galaxy AI and better camera range and control.
The following is a partial deep dive into the Samsung S25 smartphone conducted by TechInsights.
Summary
- 6.85-inch, AMOLED 3120/1440 pixels
- 12 GB mobile LPDDR5X SDRAM
- 12 MP BSI CMOS wide-angle
- 200 MP BSI CMOS wide-angle
Released: February 2025
Price: $1,419.99
Target market: Consumer and communications
Availability: Worldwide
Main board
The main board contains the applications/baseband processor from Qualcomm in the form of the 201-AC octa-core Snapdragon 8 Elite and Samsung’s multichip memory module with 512 GB 3D NAND flash and memory controller. Other electronic components include:
- Samsung’s secure element chip and camera power management IC
- Micron’s 12 GB mobile LPDDR5X SDRAM
- Texas Instruments’ Class-D audio amplifier
- Analog Devices’ power management IC
- NXP Semiconductors’ eUSB 2.0 to USB redriver
- ST Microelectronics’ wireless power receiver
- Qualcomm’s power management IC and clock buffer
- Cirrus Logic’s haptic driver
- Sensortek’s color, ambient light and proximity sensors with IR emitter
(Learn more about power management chips on Globalspec.com)
The secondary board found inside the Samsung Galaxy S25 Ultra. Source: TechInsights
Secondary board
The secondary board of the Samsung Galaxy S25 Ultra includes the following electronic components including:
- Qualcomm’s RxD front-end module and RF antenna tuner
- Goertek’s MEMS microphone
- Infineon’s SPDT RF switch
(Learn more about MEMS chips on Globalspec.com)
RF board
On the RF board of the Samsung Galaxy S25 Ultra contains the following electronic components:
- Qualcomm’s 2.4 GHz Wi-Fi front-end module, RF antenna tuner and RxD front-end module
- Goertek’s MEMS microphone
- Wisol’s RxD front-end module and SAW filter
- Skyworks’ quad-band GSM/L8 front-end module
- Murata’s MB/HB front-end module and SAW filter
- Infineon’s SPDT RF switch
- AKM Semiconductor’s three-axis electronic compass
- Bosch Sensortec’s digital barometric pressure sensor
- ST Microelectronics’ six-axis MEMS accelerometer and gyroscope
(Learn more about RF components on Globalspec.com)
Some of the electronic components found inside the Samsung Galaxy S25 Ultra. Source: TechInsights
Major components
- $145.02 — Octa-core Snapdragon 8 Elite applications/baseband processor — Qualcomm (Qty: 1)
- $57.19 — 200 MP wide-angle rear camera subsystem (Qty: 1)
- $42.42 — 120 Hz Display/touchscreen subsystem — Samsung (Qty: 1)
- $35.47 — Multichip memory — 512 GB 3D TLC V-NAND flash, memory controller (UFS 4.0) —Samsung — (Qty: 1)
- $33.37 — 50 MP periscope telephoto rear camera subsystem (Qty: 1)
- $31.42 — Multichip memory — 12 GB mobile LPDDR5X SDRAM - Micron (Qty: 1)
- $26.56 — 50 MP ultra-wide-angle rear camera subsystem (Qty: 1)
- $21.05 — 10 MP telephoto rear camera subsystem (Qty: 1)
- $19.60 — Main frame (Qty: 1)
- $17.01 — Ultrasonic fingerprint sensor subsystem (Qty: 1)
