Samtec, Inc. announces product expansion of its popular mPOWER ultra micro power interconnect system. New mPOWER vertical board connectors (UMPS, UMPT) and right-angle board connectors (UMPT-RA) are now available with through-hole board termination options, providing the enhanced mechanical robustness that is often required in harsh industrial, military and aerospace applications. Connector designs using surface mount technology are also available. 
Source: Samtec, Inc.
Designed for power density, mPOWER ultra micro connectors offer a 40% space savings over conventional power connectors. Their compact form factor supports up to 18 A per power blade, enabling reliable high current performance without sacrificing board space.
In addition to power density, mPOWER interconnects provide design flexibility across board-to-board, wire-to-board and wire-to-wire applications. System design is simplified through a range of options, including vertical and right-angle configurations, stack heights from 5 mm to 20 mm, rugged latching features and 2 to 10 power positions. PVC or Teflon fluoropolymer cable assemblies are available in multiple wire gauges to support varying application needs.
