FCI, Samtec Ink Second-source Pact

05 September 2014

Connector manufacturers FCI Electronics and Samtec Inc. have signed a second-source agreement under which Samtec will be licensed to manufacture and sell FCI’s next-generation ExaMAX high-speed connector products.

“This second-source agreement pools technology and manufacturing capabilities of both companies to provide for FCI’s new ExaMAX high-speed connector solutions,” said Alessandro Perrotta, CEO of FCI Electronics, based in Singapore.

He added that FCI was pleased to have an agreement with Samtec, a company that “shares a similar vision in providing superior customer service, quality and technological innovation.” He said Samtec was “well positioned” to manufacture and sell FCI products.

John Shine, CEO of Samtec, based in New Albany, Ind., said both FCI and Samtec are “signal integrity leaders with fully-integrated worldwide manufacturing” to support customers.

He said FCI’s EXAMax products will fill an important role in “our ability to supply our customers with high-speed connections through the full-signal chain.”

Shine added that Samtec is fully committed to support FCI’s customers as their second source, and to increase the installed based for the system with our customers.

The ExaMAX product family can be used in a wide range of system architectures, including traditional backplane, direct orthogonal, internal and external IO, coplanar and mezzanine applications.

Samtec makes a wide range of connectors including high-speed board to board, rugged/power connectors, edge-card and microbackplane connectors and RF interconnects among others.

FCI builds backplane, board/wire-to-board, input-output connectors and optical interconnect among others.

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