Electronics and Semiconductors

Board-to-Board Connectors Tackle Multi-Gigabit Data Rates

09 December 2016

Global interconnect solutions provider Samtec has released a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. The ANSI/VITA 57.4-2016 standard extends the capabilities of ANSI/VITA 57.1-2010 to support high data rates of multi-gigabit interfaces found in advanced FPGA architectures. It defines the FPGA Mezzanine Card Plus (FMC+) connector set, which offers a new high serial pin count (HSPC) connector containing 560 pins in a 14 × 40 array, and supports up to 24 multi-gigabit interfaces. A second optional high serial pin count extension (HSPCe) connector offers 80 pins in a 4 × 20 array, and supports up to eight additional multi-gigabit interfaces.

High-speed board-to-board connectors offer system-level throughput of 896 Gbps. High-speed board-to-board connectors offer system-level throughput of 896 Gbps. Together, HSPC and HSPCe connectors support up to 32 multi-gigabit interfaces with each multi-gigabit interface handling up to 28 Gbps data rates. As a result, per the ANSI/VITA 57.4-2016 standard, the 32 channels of the connectors support a maximum system-level throughput of 896 Gbps. For proper mating with FMC high pin count (HPC) and low pin count (LPC) connectors, the HSPC connector employs a custom polarization system, said the manufacturer. Plus, it enables additional signals without compromising board profiles or mechanics. Also, the ANSI/VITA 57.4-2016 is backward compatible with ANSI/VITA57.1-2010 FMC modules.

According to Samtec, the application-specific product versions of high-density open pin field arrays, called SEARAY, have been adopted by VITA 57.4 to support the growing FMC+ ecosystem in applications such as high-speed analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), next-generation RF connectivity, high-speed serial memory, and high-density fiber optics.

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